Electronics Forum | Sun Dec 11 20:23:52 EST 2005 | grantp
Hi, As far as I know soldering a lead free BGA in a lead process is similar to soldering down some BGA's such as ceramic that had high temp solder balls. Remember back when a lot of BGA's had hi temp solder balls that also did not collapse during re
Electronics Forum | Thu Jan 05 15:42:26 EST 2006 | samir
Grant, The strength of the joint in a CCGA is the column for one...it's more ductile, made out of 90% Pb, and it's meant to compensate for the massive CTE mismatches between the ceramic and the board (ie the columns flex to relieve stress from the e
Electronics Forum | Fri Nov 21 14:15:09 EST 2003 | russ
If you use regular solder paste you will not need to process at the higher temp. Using Flux only will require you to reflow the lead free balls. When we process ceramic BGAs with the high temp/lead free balls we always use 63/37 paste and it works
Electronics Forum | Thu Feb 18 17:15:24 EST 1999 | Jason Gregory
Check this company out....Winslow Automation. They have a real easy "preform" for reworking BGA's. You just wick the old solder off, flux the packages, attach an appropriate preform, reflow it with a corresponding profile, remove the water-soluble pa
Electronics Forum | Wed May 29 14:42:53 EDT 2002 | jaltland
I have another question about bga's and stencils. We were told by a manufacturer to use .012 square apertures for .009 dia balls. The original pick & place and reflow goes pretty well (over 95% good), however when we have to select components on th
Electronics Forum | Sun Feb 15 18:07:18 EST 1998 | Scott McKee
| I am beginer in BGA assembly and am confused in selection of pick and place option. As per book on 'implementation of BGA Technology-by 1995 aeic inc. states that BGAs reflow is quite forgiving and you need only Mechanical centering of PBGAs. The I
Electronics Forum | Wed Dec 15 19:31:26 EST 2004 | Thomas Denison
We have a ceramic BGA that the component supplier has misaligned the spheres in the fixture so they slant .007" out of alignment from the substrate pads. When the devices are tested at the component manufacturer this alignment issue also causes the
Electronics Forum | Thu Feb 18 21:51:48 EST 1999 | Dave F
| What are some suggested standards/speced requirements and procedures for removal/addition of missing balls on laminate and ceramic based bga packages and quality requirements for same. | 3: I'm unaware of such documentation, but then again documen
Electronics Forum | Mon Apr 12 22:49:09 EDT 2004 | Ken
I will assume the balls of the device are tin-silver or tin-silver-copper??? There is no reason why you can not run 63-37 solder paste on this device. You will form an intermetallic at the interface structure, however, you will NOT form the 2/3 col
Electronics Forum | Thu Dec 10 09:09:31 EST 1998 | Earl Moon
| Hi everybody? | I heard that typical FR-4 would not acceptable for BGA application. | What is the main reason? | (thermal property? or CTE?) | Sombody please answer me the requirement of PCB substrate for PCB application. | Thanks. | | Youngho Son