Electronics Forum | Mon Mar 21 12:43:20 EDT 2011 | hegemon
Passives first reflow, and BGAs second side reflow. Uses only one heating cycle for your BGAs, and the passives will stay in place just fine given correct profile parameters. There are a few exceptions, but this is generally how it is done. My $.02
Electronics Forum | Mon Nov 25 13:00:12 EST 2002 | steve
Ersa is the choice for lower end repair and rework systems. Airvac is the choice for higher end systems. Stay away from low end hot air units. They typically do not present an even flow of heat across the component. The Ersa requires no nozzles, whic
Electronics Forum | Fri Jun 28 06:12:27 EDT 2013 | grahamcooper22
If the soldering process isn't heating the whole package up to soldering temp then NO you don't need to keep them DRY (using a soldering iron to fit a QFP for example)....but if the soldering process is done on a rework station or in a manner where t
Electronics Forum | Mon Aug 25 00:31:53 EDT 2003 | Dennis O'Donnelll
It could be moisture in the BGA. You should always bake the BGA before installation of course. But most likely you are usingf too much heat or too fast of a ramp speed. Make sure your top heater temp is below 230C. Set top heater to 220C, then adj
Electronics Forum | Fri Aug 13 10:00:45 EDT 1999 | Boca
| | Ladies and Gentlemen, | | | | As a newly appointed DFM/CE "guru" here, one of my responsibilities has become repair (of course). As I have some knowledge of BGA repair/rework using semi-automated equipment, it naturally follows I would hav treme
Electronics Forum | Fri Aug 13 13:00:08 EDT 1999 | Earl Moon
| | | Ladies and Gentlemen, | | | | | | As a newly appointed DFM/CE "guru" here, one of my responsibilities has become repair (of course). As I have some knowledge of BGA repair/rework using semi-automated equipment, it naturally follows I would hav
Electronics Forum | Fri Aug 13 13:25:09 EDT 1999 | ScottM
| | | | Ladies and Gentlemen, | | | | | | | | As a newly appointed DFM/CE "guru" here, one of my responsibilities has become repair (of course). As I have some knowledge of BGA repair/rework using semi-automated equipment, it naturally follows I wou
Electronics Forum | Mon Oct 25 17:50:46 EDT 2004 | Mike
I work for a PCB Manufacture and I am looking for info on BGA Pull test or strenght test. I have a CM that is experiencing bga's with some weak joints. they are telling me that when they do their pull test the joints are breaking at the nickel inste
Electronics Forum | Fri Feb 01 14:49:52 EST 2013 | emeto
Thank you guys. You keep adding valuable information here. I think we will try to stick with the 3 times reflow(if we count the BGA repair as 2 reflows). However sometimes we will run the board second time through the oven(just flux the suspect part
Electronics Forum | Thu Mar 29 13:15:18 EDT 2007 | adrian_nishimoto
We always apply solder paste to either the PCB pads or the BGA balls. I have found that only using liquid or tacky flux does not always ensure proper wetting of the pads. Also The BGA sits closer to the PCB making cleaning and endoscopic inspection
.gif)
