Electronics Forum | Thu Oct 28 13:36:14 EDT 1999 | Bart Smith
I am a design engineer and have a circuit board design with a 292 pin BGA on it. The board manufacturer is experiencing a failure rate of about 2.8% on the BGA device due to soldering problems. This is my first experience with BGA. How does the 2.
Electronics Forum | Thu Feb 24 23:11:51 EST 2011 | kemasta
HI I have this BGA short issue, I took x-ray image, the solder ball having big void. We suspect the pad on BGA was oxidie. Reject percentage quite low, only 5 out of 6000. But after the BGA re-ball, is work fine. Anyone have any idea to trobleshoot
Electronics Forum | Tue Jan 15 12:20:16 EST 2002 | cfraser
This sounds like it could possibly be a case of Black Pad. We have had a few issuses with this in the past as well. Who the PWB vendor? I also recommend searching the archives and doing some solder samples with nonpopulated boards
Electronics Forum | Fri Feb 01 11:58:28 EST 2002 | Romain
the PCB vendor is Multek in germany he made some measures about P content in Ni layer. What is the normal level of Phosporous and what is the upper limit ? thanks Romain
Electronics Forum | Tue Jan 15 06:05:37 EST 2002 | Romain
Dear all We have since few weeks problems with BGA solder joint integrity on ENIG finish. Under relatively very flexible of the FR4, the joint breaks between ball and PWB. When we take off the BGA for analysis, some of the pads seem very flat, totaly
Electronics Forum | Mon Aug 23 05:00:20 EDT 2004 | Jefflee
Hi, Would like to know if the design of the Bga pad is depth and after used solder wick and soldering iron to remove the the damage solder ball,there are still remaining solder inside the pad.Is there any method to remove the remaining solder. Thank
Electronics Forum | Tue Jan 15 09:42:40 EST 2002 | davef
Here's two choices. 1 Before accepting a lot of boards from your supplier: * Print some paste on a board * Reflow the paste * Inspect the quality of the solder connection * Make a decision on accpting the board based on that observation. 2 Have yo
Electronics Forum | Mon Aug 23 21:47:49 EDT 2004 | Jefflee
Hi Terry, Thanks for the reply,but if the Bga are in big quantity like 10k and above,is there any faster method to solve this problem
Electronics Forum | Tue Aug 24 12:20:33 EDT 2004 | davef
The methods Terry mentioned are good, but our operators are too impatient. Here's how they do site prep, after removing the BGA: * Use a soldering iron to melt the solder at the base of the ball. * Flick the ball[s] from the pad[s] with the solderin
Electronics Forum | Sat Nov 03 09:39:27 EDT 2007 | davef
Flux exhaused or CSP never came to peak temperature * BGA balls don't combine with the solder => Flux exhaused or BGA balls never came to peak temperature * 0402 surface looks like many tin balls piled together => Flux exhaused Start your thermal
