Electronics Forum | Fri Feb 19 05:14:04 EST 2016 | truewanderer
Hi, i have a confusion to read the dimension of BGA package from the datasheet. I have attached the datasheet below. Is this diameter of the ball 0.30mm or 0.15mm. I'm confused about the values given in the box. Whats meant by M, S, A and B. Please g
Electronics Forum | Mon Feb 05 21:56:31 EST 2007 | ViVian
what type of solder paste I should use if Rohs and non rohs component mount on same board
Electronics Forum | Tue Feb 06 13:16:09 EST 2007 | jaimebc
Leaded paste, is what we use if the process or product requires it.
Electronics Forum | Tue Jul 13 06:49:53 EDT 2004 | imtiaz
In one board we are using 213 SMT components out of which 23 components are lead-free and the rest are leaded. The paste used is also leaded. Do we have to make any changes in the profile of our reflow oven ? Also will there be any negative effect on
Electronics Forum | Wed Apr 30 12:26:10 EDT 2008 | dphilbrick
There must be discussions about this on SMTnet but I have yet to find them. I would like to hear from all you smart people about running LF and PB BGA�s on the same board using 63/37 solder. If you run your profile up to peak at around 225C +/- (nitr
Electronics Forum | Tue Jul 13 07:22:43 EDT 2004 | Kris
Hi Imtiaz, Can you give a brakup of the 23 components and their end mettalurgy ? Chip ?? QFP/TSOP ?? BGA ?? Aluminium Caps ?? this will determine whether you can do it or not
Electronics Forum | Tue Jul 13 10:12:06 EDT 2004 | davef
While you're waiting for others to reply, consider searching the fine SMTnet Archives for threads like this: http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=7290&#Message29140
Electronics Forum | Tue Feb 06 12:53:59 EST 2007 | CK Flip (MOTW)
ViVian, check the great SMT archives. Below is a good thread on this very topic. :-) http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=11344&#Message47106
Electronics Forum | Tue Feb 06 21:43:11 EST 2007 | Wayne
If it is instructed to ship lead free product to customer, then low temp lead free solder paste can be considered. For example, Viromet solder paste from Singapore Asahi (peak temp is between 220 to 225 degree C).
Electronics Forum | Mon Feb 19 15:32:42 EST 2007 | blnorman
We use SnPb paste and bar with leaded and non-leaded component finishes. The predominant finish on components we use is Tin, there are a few NiPdAu. We've had no problems with the component finishes used in the SnPb process.
