Electronics Forum | Tue Mar 16 18:36:11 EDT 2010 | janz
Looking for a large area wire ball bonder or > wedge bonder. Must be able to take 4" X 5" panel > and have a bond area of close to 3.5" X 4.4". > Also need 6 to 8 wire per second. K&S no longer > makes one. Panasonic no longer makes one. ASM
Electronics Forum | Tue Jan 30 17:58:49 EST 2007 | flipit
Hi, I would not be too concerned about what the shape of your wirebonding fiducial is. Cross, Square, Diamond, Circle, will all work well for you. I use a "+" and a diamond. Your machine magnification will be great, so don't make the fiducials to
Electronics Forum | Mon Dec 28 12:16:40 EST 1998 | Jon Medernach
Chris, We are involved in several developments using gold stud bump attach. We make a stud bump bonder and have several processes for attach. Solder attach is best done by plating up the substrate, the underfill must be able to provide enough mechan
Electronics Forum | Tue Dec 29 10:24:35 EST 1998 | Earl Moon
| Chris, We are involved in several developments using gold stud bump attach. We make a stud bump bonder and have several processes for attach. Solder attach is best done by plating up the substrate, the underfill must be able to provide enough mech
Electronics Forum | Wed Aug 09 13:30:29 EDT 2006 | dsoohoo
I am searching (though so far unsuccessfully) for an SMT adhesive that I can get in both white and black as opposed to the common red. My company does a lot of work with LED's and the red bonder has a tendency to affect the light output of LED's with
Electronics Forum | Thu Apr 20 14:19:46 EDT 2000 | Joanne DeBlis
Hi Paul, Another method of achieving a planar surface is PPT. This may alleviate the problem your having. For additional information you can visit our web site at masktek.com. Joanne DeBlis
Electronics Forum | Tue Oct 19 14:51:27 EDT 1999 | Kiet Dang
I'm trying to set up a SPC for a thermo compression beam lead attach process. We're using a west bonder thermo compression machine. I'd appreciate any input on temperature, pressure,tool, and critical process considerations. thanks, -kiet.
Electronics Forum | Thu Mar 17 10:30:06 EST 2005 | davef
This happens. You may need to put a dot of chip bonder on the corner of the floating QFP after first pass. What size are the QFP that are moving?
Electronics Forum | Thu Dec 15 16:12:56 EST 2005 | davef
Liza Could increases in adhesion due to exposure to high temperature and humidity in storage environments be an explantion to this cover tape excessive bonding issue? We agree with GS that heat bonding is so 1970s. Most heat bonders can fairly eas
Electronics Forum | Mon Aug 14 09:58:34 EDT 2006 | RLM
Check Epotek http://www.epotek.com Look in their General adhesive section. Epotek 600 is black if it will work for you.
