Electronics Forum | Fri Nov 30 08:35:51 EST 2007 | stepheniii
We put glue on the bottom of the board that already has the topside SMT mounted. We populate the board. We put it through a cure profile. At this stage the topside components are soldered on. The bottom side components are glued on with NO solder on
Electronics Forum | Thu Mar 15 16:58:11 EST 2001 | mparker
The only way I know of waving the bottom side with SMT parts installed without epoxy would be to use a masking media, Kapton Tape, wave pallet that keeps those parts from being susceptible to gravity once the connections are reflowed. If there is ano
Electronics Forum | Tue Oct 26 11:22:45 EDT 1999 | Morris
I am evaluating a bottom side glueing process. I was wondering if anyone could share their shear force specifications, or how they were developed. I would be most interested in the 0805 and Sot23 package types. Also, does anyone know if heating th
Electronics Forum | Thu May 09 16:04:07 EDT 2002 | stownsend
The lighter the component, the more likely it is to stick to the solder on the bottom reflow side. All boards I have worked with, the descrete components (R's and C's) are placed first (bottom side), reflowed, then the active components (IC's) are pl
Electronics Forum | Tue Mar 13 18:25:45 EST 2001 | slthomas
Anyone doing a print-dispense-place-reflow process? I've never heard of it being done this way before today. Don't know why, actually, as it sounds like a fairly friendly method provided the adhesives used are happy with a standard reflow profile.
Electronics Forum | Fri Apr 10 14:10:13 EDT 1998 | Jim Hoxie
We are having a bridging problem with SOIC 14,16 and 20 pin devices during flow solder of the bottom side of our boards. This bridging occurs about half way up the lead between the board and the body of the IC. The chip parts are no problem. The f
Electronics Forum | Fri Apr 10 14:08:51 EDT 1998 | Jim Hoxie
We are having a bridging problem with SOIC 14,16 and 20 pin devices during flow solder of the bottom side of our boards. This bridging occurs about half way up the lead between the board and the body of the IC. The chip parts are no problem. The f
Electronics Forum | Fri Dec 19 07:31:58 EST 2008 | realchunks
Ersa selective solder machines for us. We have 5 dual pot machines and run double sided reflow - double sided thru hole.
Electronics Forum | Thu Mar 15 11:12:45 EST 2001 | slthomas
solder, but flux -> adhesive. Hmmmmm.... Are the chemists working hard to reduce the consequences of these possibilities? And as to Dave's comment about long term reliability issues due to outgassing from the adhesive, double-hmmmmmmm....... Ther
Electronics Forum | Thu Mar 15 11:18:12 EST 2001 | slthomas
That makes us almost even, Dave. I have a hard time believing half of what you say. ;)
