Electronics Forum | Wed Nov 07 11:56:44 EST 2001 | mparker
Pad spacing is just one element to consider. Your pad spacing is determined by the pitch (center to center distance between the leads). There are several good resources to find the appropriate pitch per device. Search the archives here or refer to th
Electronics Forum | Mon Dec 06 12:33:49 EST 1999 | Wolfgang Busko
Hi Glen, is it a wavesoldering or reflow problem ? Check the difference between the boards that show this symptom and those that doesn�t. Are there differences in the material, the handling, the processes, pitches etc. Looking at that should help you
Electronics Forum | Wed Jun 25 11:30:04 EDT 2008 | samir
or... like this? 0 0 0 0 0 0 0 0 0 0 0 0 FLOW DIRECTION --->
Electronics Forum | Thu Jun 26 12:46:33 EDT 2008 | frankr
One way we handle this situation is to produce a wave pallet that presents the pcb at an angle to the wave to stagger the leads of the connector.
Electronics Forum | Thu Jun 26 13:24:25 EDT 2008 | realchunks
Do you glue SMT parts on the bottom? If so, use your SMT glue to prevent the short. Just cut a new stencil with 0.020" wide apertures between the pads of the connector (bottom side). We do it all the time.
Electronics Forum | Tue Dec 14 12:41:56 EST 1999 | Kris W
Glen, Although the previous answers probably fit the problem you are having, we recently found that during pin insertion on an Autosplice machine, the gold was flaking from the pins and lodging between the legs of surface mount components. It would
Electronics Forum | Fri Apr 10 20:35:59 EDT 1998 | Steve Gregory
| | We are having a bridging problem with SOIC 14,16 and 20 pin devices during flow solder of the bottom side of our boards. This bridging occurs about half way up the lead between the board and the body of the IC. The chip parts are no problem. T
Electronics Forum | Mon Apr 13 08:42:32 EDT 1998 | Bob Silveri
| | | | We are having a bridging problem with SOIC 14,16 and 20 pin devices during flow solder of the bottom side of our boards. This bridging occurs about half way up the lead between the board and the body of the IC. The chip parts are no proble
Electronics Forum | Wed Apr 15 15:04:18 EDT 1998 | D. Lange
| | | | We are having a bridging problem with SOIC 14,16 and 20 pin devices during flow solder of the bottom side of our boards. This bridging occurs about half way up the lead between the board and the body of the IC. The chip parts are no proble
Electronics Forum | Wed Apr 15 14:57:20 EDT 1998 | D. Lange
| | | | We are having a bridging problem with SOIC 14,16 and 20 pin devices during flow solder of the bottom side of our boards. This bridging occurs about half way up the lead between the board and the body of the IC. The chip parts are no proble
