Industry News | 2012-03-21 17:42:19.0
For many designers and manufacturing personnel in the electronics manufacturing supply chain, IPC-AJ-820, Assembly and Joining Handbook, is the document of choice for all aspects involved in creating a PCB.
Industry News | 2018-05-13 07:28:32.0
The SMTA and the Center for Advanced Life Cycle Engineering (CALCE) announce the technical program for the Symposium on Counterfeit Parts and Materials this June 26-28, 2018 in College Park, Maryland.
Industry News | 2012-09-26 15:57:01.0
l IPC Electronic System Technologies Conference (ESTC) will take place May 20–23, 2013, with an accompanying exhibition on May 21–22 at the New Tropicana Hotel in Las Vegas.
Industry News | 2017-01-17 15:46:08.0
IPC's Validation Services Program has awarded an IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing (QML), meeting Class 3 requirements, to Colonial Assembly and Design, LLC, a wholly owned subsidiary of Zentech Manufacturing. Following an initial audit by IPC, Colonial Assembly and Design, LLC joins Zentech as one of the less than ten U.S. trusted sources and suppliers meeting the stringent requirements of the Qualified Manufacturing Listing based on two of IPC's foremost standards: IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610, Acceptability of Electronic Assemblies.
Industry News | 2020-06-24 15:45:07.0
IPC and High Density Package Users Group (HDP) have signed a Memorandum of Understanding (MoU), enabling a strengthened partnership, increased technical collaboration between groups, and providing a mutual path toward emerging and disruptive high density interconnect (HDI) technologies.
Industry News | 2018-06-04 18:00:34.0
If your company has e-textiles and/or stretchable technologies on its roadmap and you find yourself asking the question, “How can I merge smart fabrics with smart engineering?” IPC has developed a technical and business education workshop to answer these questions and more. IPC E-Textiles 2018 will take place on September 13, 2018 in Des Plaines, Ill., and will bring together innovators, technologists and engineers to collaborate, and identify partners and solutions to propel growth for the e-textiles market.
Industry News | 2012-04-06 16:02:03.0
When a component manufacturer discontinues a particular component, it creates a ripple effect throughout the electronics assembly industry, leaving EMS providers with myriad critical questions to answer.
Industry News | 2012-08-23 16:23:11.0
IPC — Association Connecting Electronics Industries®. Joining the illustrious ranks of only three other companies, MacDermid, Inc. and Northrop Grumman are celebrating 50-year membership anniversaries
Industry News | 2023-10-23 09:48:49.0
IPC, part of MAPT Roadmap Extended Executive Committee provides data on next generation advanced packaging, materials, substrates, and supply chain future needs
Industry News | 2018-03-22 21:11:24.0
Nordson ASYMTEK introduces the new Helios™ SD-960 Series Automated Dispensing System for medium and bulk volume deposits of single- (1K) and two-component (2K) materials in electronics manufacturing and printed circuit board assembly. The Helios system is ideal to deposit volumes greater than 1cc, and line widths and dots that exceed 1mm, but it can deposit volumes down to 0.3cc and line widths as narrow as 0.3mm. The system supports highly abrasive thermal interface materials (TIM), silicones, epoxies, and grease for applications such as potting, sealing, gasketing, and structural adhesives.
