Electronics Forum | Thu Apr 17 13:37:11 EDT 2014 | anvil1021
Hello All....we have several hundred PCBs that we need to run with a no-clean solder process and the surface finish is OSP. Our preliminary testing has found that the solder will not wet the entire pad even if the pad is over printed? We have contact
Electronics Forum | Thu Sep 27 09:53:46 EDT 2012 | testbloke
Anyone ?
Electronics Forum | Sat May 15 11:27:26 EDT 2010 | davef
We'd expect both OSP poor wetting and improper reflow recipe to show-up in more places than just this one component. But if those are the only choices, we'll go for 'wrong solder paste.' Ooops, that's not one of the choices. Ok, OK, we'll take poo
Electronics Forum | Fri Apr 18 14:25:51 EDT 2014 | horchak
what is the technology? Is there fine pitch, double sided, number of layers, lead free? If the pcbs are not of the highest quality you may be set up for failure with no clean process. Couple things to look at is your paste flux content versus medal
Electronics Forum | Wed Sep 26 10:05:41 EDT 2012 | testbloke
Although we do not have any soldering issues with our OSP PCB's, I am trying to establish clear rules with regards pcb storage and shelf life. Our PCB's are supplied in metalised moisture barrier bags but without desicant, our current rules as follow
Electronics Forum | Fri Apr 06 08:27:09 EDT 2001 | CAL
From what you are saying................If I hear ya correctly - There is no "Proctective" on the Pads (OSP, HASL....) You will be hard pressed soldering to bare copper. This can not be right. My suggestion- go polyimide with electroptical connecti
Electronics Forum | Fri Apr 06 08:28:34 EDT 2001 | CAL
From what you are saying................If I hear ya correctly - There is no "Protective" on the Pads (OSP, HASL....) You will be hard pressed soldering to bare copper. This can not be right. My suggestion- go polyamide with electroptical connectio
Electronics Forum | Tue Aug 22 14:59:55 EDT 2000 | Mike Naddra
What does the reflow profile look like , the question I had was surrounding the higher reflow temperature and the max temperature that lowest thermal mass components will see. Some other questions that I had were surrounding the components , what of
Electronics Forum | Tue Aug 22 16:02:07 EDT 2000 | Dr. Ning-Cheng Lee
If the thermal mass of the products is small, a tent-shaped profile is recommended, with peak temperature around 240C. The hottest spot on board should be less than 250C. However, if the thermal mass of the product is large, such as a large server PC
Electronics Forum | Thu Jan 12 10:05:13 EST 2006 | davef
There's a lots comparisons like this on the web. Here's one: Westwood Associates said on 8/12/2003: ||HASL||OSP||ENIG||Pd||Tin||Silver Flat||no||yes||yes||yes||yes||yes Solderjoint||Cu-Sn||Cu-Sn||Ni-Sn||Ni-Sn||Cu-Sn||Cu-Sn Contact||E-test, ICT||no|
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