Electronics Forum | Mon Aug 24 13:12:28 EDT 2009 | ghepo
OK Eric, maybe you're right. My suggestion is to proceed by exclusion. First perform the tape test. Is easy and without costs. You have used many similar PCB without problem, but from the same vendor ? Is my experience that in similar cases the qua
Electronics Forum | Mon Aug 24 17:58:10 EDT 2015 | warwolf
We have had some test results come back after we were getting poor wetting in our joints, we requested an EDS on our joints from our PCB supplier. They have provided the results and said that it was their fault and will replace. What I want to know
Electronics Forum | Tue Jul 18 20:10:09 EDT 2000 | Dave F
Hey Bud: Thanks for the response the other day. We currently use "Jeff�s Method #2: The Drummel Tool." Short answer to your brother is ... yes, probably. Expanding a bit: � It would be surprising not to use a flux to help reflow the solder balls
Electronics Forum | Mon Nov 15 21:35:50 EST 1999 | Dave F
Bob Bob: Fortunately, you found this before you built-up a lot of product. Some thoughs and other drivel: 1 Use IPC-TM-650, Method 2.4.8 for copper peel with a Instron machine. Typical pad peel strength requirement for FR-4, 2 oz. copper is: 6 l
Electronics Forum | Tue Feb 11 22:28:25 EST 2003 | davef
What do you mean by "new information"? On final module testing: * If you have hypercorroded nickel and you detect it during final testing, you'll notice it. * If you have hypercorroded nickel and you don't detect it during final testing, you'll ship
Electronics Forum | Mon Aug 10 11:28:19 EDT 1998 | Justin Medernach
| Is there any problem using SMT on gold boards? 15 years ago we were told not to use gold boards, but I can't remember why. Judging by the other postings it now appears to be common. Only problem I see is that the nickel should be plated, not ele
Electronics Forum | Tue Dec 29 17:42:27 EST 1998 | Dave F
| Can anyone recommend a solder stop that can be applied by our PCB supplier. Our current material form Tamura Kaken is causing problems. | | The material should be capable of withstanding 1 Surface mount IR reflow cycle and 1 wave solder cycle. | W
