Electronics Forum: case (Page 3 of 246)

Re: Pick and place from bulk case

Electronics Forum | Wed May 03 20:10:57 EDT 2000 | Dave F

Erhard: Several companies make feeders that move leadless chip components from a bulk feeder carrier, line them up head-to-tail, and present them to the pickup head of a high speed placement machine. Try: * Panasert * Suzuki � but you probably a

First documented case of tin whisker formation

Electronics Forum | Tue May 16 13:53:19 EDT 2006 | patrickbruneel

Hi Rob, Don't feel sorry I like these discussions make us think more thorough. This is the supporting scientific paper they used in support of the exemption request. Effects of lead on tin whisker elimination By Wan Zhang and Felix Schwager. http:

First documented case of tin whisker formation

Electronics Forum | Mon May 22 11:28:56 EDT 2006 | Rob

Hi Pat, The main driver for the UK on Lead-Free is to avoid leachate in our drinking water & in the food chain. Whilst John Burke's report is compelling & I agree with him on the points he has raised, regarding the leachate issue he has referenced

First documented case of tin whisker formation

Electronics Forum | Thu May 11 13:28:49 EDT 2006 | patrickbruneel

Being a typically efficient Swiss based company Swatch started the task of RoHS conversion a year ago. After 2 years of intensive research they implemented the process in mass production in June 2005, they started shipping and found massive problem

Ceramic case resonators falling to pieces after reflow soldering.

Electronics Forum | Wed Aug 30 00:16:15 EDT 2000 | Craig

We are reflowing ceramic resonators and are finding their tops falling/popping off when handling the pcbs during final assy. The epoxy seems to be coming off the components base and adherring to the lid. The components are "RFM resonators", case type

Re: Ceramic case resonators falling to pieces after reflow soldering.

Electronics Forum | Wed Aug 30 14:57:43 EDT 2000 | John Thorup

Hello Craig Are code dates other than these two coming apart or do they stay together? If other dates stay together you should get together with RFM. Did the process work before and and the defects just start happening? These are pictured on the RFM

Gerver vs. ODB++ in case of there's some Impedance control line

Electronics Forum | Fri Apr 03 02:15:23 EDT 2009 | roy1209

I've heard from my company's engineer that it'll be better to use Gerber format if there's some impedance control line . Because usually Gerber has code numbers in data and someone can easily refer to controlled line on the PCB and ODB++ doesn't have

Juki KE-730 Comapred to Zevatech FS-730

Electronics Forum | Wed Aug 30 05:37:57 EDT 2017 | alexandrdmc

Phone case iphone 7 plus, best buy phone case iphone. Case for iPhone 7 plus is high in quality and looks great. In terms of protection though it won't protect your screen. It will only protect side and the back scratches. Cover fits really. Hugs tig

TSOPII junction-to-case thermal resistance

Electronics Forum | Tue Aug 18 18:55:04 EDT 1998 | Sam Guilaume

Does anyone know the actual junction-to-case thermal resistance for TSOPII packages.

Datapaq Q18 strange things

Electronics Forum | Thu Mar 17 10:06:09 EDT 2011 | dyoungquist

Strange indeed. We use a Q18 and have never seen this. Is it sweating inside the thermal barrier case, i.e. you put it in the case dry and it is wet when you take it out of the case? Maybe its actually coming from the inside of your thermal barrie


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