Electronics Forum | Mon Nov 27 19:00:52 EST 2000 | Christopher Noonan
When the are up and running they are hard to beat, but when they go down they go down hard. Keep field service close. Don't get me wrong they're great machines and the company I used to work for had some of the first machines available. I come fro
Electronics Forum | Fri Aug 23 16:02:37 EDT 2002 | davef
Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies; John Lau; McGraw-Hill Professional; ISBN: 0071351418; 2000 * Chapter 6. Flip Chip on Board with Conventional Underfills. * Chapter 7. Flip Chip on Board with No-Flow Underfills. * C
Electronics Forum | Fri Jul 04 19:17:37 EDT 2014 | andrespena
Hi (I don't know if this forum is the best place to post something like this, but I don't know of other places on the internet, so... sorry if I'm in the wrong place) Might there be an easier way to add components (e.g. computer chips) to a circuit
Electronics Forum | Sun Aug 26 12:40:59 EDT 2001 | stefwitt
I would like to enter the discussion by tossing some numbers in. First of all I don�t like the 3 Sigma value. 3 Sigma are 2000 defects per mio. if I remember correctly. This means, if you have 200 components on the board, then every 10 boards have on
Electronics Forum | Fri Jun 23 10:10:15 EDT 2006 | Gman
Some amount of voiding was always seen on sites where solder paste is printed. These voids are much smaller. However the site where a flip chip is flux dipped has never had problems with voiding. Macro voids (and huge ones at that)across the board s
Electronics Forum | Mon May 07 11:02:17 EDT 2001 | Singh
Hi all. I am looking into the implementation of the Chip on Board process with eutactic bonding and the then using either gold or aluminum wire to make wedge type wire bonding. Since I am totally new to this, can somebody guide me thru the process,
Electronics Forum | Mon May 26 08:23:49 EDT 2014 | mun4o
hi all, we have smd line with 2 Assembleon topaz X.The real speed of the line is about 12- 13k cph.I want to increase this speed.I intend to buy a Assembleon sapphire and change one of topaz with sapphire ( chip shooter).Has anyone of you similar c
Electronics Forum | Tue Jun 29 14:42:55 EDT 2004 | davef
You're correct, for every dumpster full of paper written about solder, there's a sentance written about fluxes. There's dribs and drabs about fluxes in most of the soldering books [ie, Manko, Klein-Wassink, Judd, Strauss, etc] and most of that is ve
Electronics Forum | Tue Jun 28 00:11:30 EDT 2016 | ricoloverde
Hi, new to the forum here. First Post! Ive been using a Samsung sm482 for about 2 years and recently got the heads up that we will be getting a project soon with a BGA chip. Im wondering if anyone on here uses the SM482 for BGA and if so, can offer
Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
