Electronics Forum | Thu Jul 06 07:40:51 EDT 2000 | Christopher Lampron
SAL, How large is the pad in relation to the solderable area on the component. I have seen similar instances where the heat sink of the component covered almost the entire bottom of the part. If your pad is the same size and the aperture is 1:1, ther
Electronics Forum | Thu Jun 29 10:38:04 EDT 2000 | John Thorup
Hello Christopher I don't know if there is any kind of official standard but I can tell you that the HADCO DFM manual specifies a nominal thickness of 50-1500u" with an option for 100-1000u" and the Merix DFM manual specifies 30-200u" Our boards (fro
Electronics Forum | Tue Jun 27 08:08:23 EDT 2000 | Christopher Lampron
Hello All, My question is in regards to repackaging moisture sensitive components. I have researched the archives and found alot of valuable information. We currently have a heat sealing machine but do not have the capability of evacuating the bag pr
Electronics Forum | Mon Jul 10 12:39:07 EDT 2000 | Chris C
Hi Christopher, To my knowledge, heat seal along will not provide you the desire condition. Currently, we're using vacuum sealer to reseal all MSD restock items. If you have variety of package and constantly need to reseal the MSD parts, I'd like to
Electronics Forum | Tue Jul 10 10:06:55 EDT 2001 | mzaboogie
Hello Dave, Sorry it took so long to reply. When we did our profile we did attach the thermocouples to the lead foot right above the pad. I suppose that the leads could have been hotter than the PCB pads although, other areas that were profiled were
Electronics Forum | Sat Apr 20 01:25:39 EDT 2002 | lysik
It is not just the rgistration fee. It is the fact that often after you register the machine you sre still denied a certian portion of service. UIC is very in check with their registration pricing. OEM's do however have a clause that says we can not
Electronics Forum | Sat Apr 20 22:50:36 EDT 2002 | lysik
I am sure the QP-132 is a more stable platform. It is a Fuki after all. My big question is why not X2 CP-6 machines. I mean you can tell by resale value of the FCM Vs the QP-132 that the QP-132 is a rock solid machine but, for such cheap money two CP
Electronics Forum | Wed Jul 31 06:50:10 EDT 2002 | mzaboogie
We have recently implemented a selective solder process using no clean flux. We have experienced a problem with "micro solder balls" Some of them are not so "micro". The equipment manufacturer stated that this is a common problem with no clean select
Electronics Forum | Thu Oct 03 15:14:46 EDT 2002 | SMTGuy
Good Day Everyone, Can anyone offer any advice on 0201 aperture design? We are looking at an application that will require them. We would like to do some experimentation first. Also, assuming an OA flux, would we need a type 4 or 5 powder paste to p
Electronics Forum | Mon Oct 28 08:54:57 EST 2002 | Chris Lampron
Good Morning, I think that the use of No clean at SMT and the use of WS at wave is counter productive. For the most part, you will get better results using WS at SMT. If you use No Clean, and then are forced to run this thought a water wash as a req
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