Electronics Forum | Mon Jan 18 12:26:37 EST 2021 | bukas
have you tried just cleaning connectors prior to IF board change? maybe it was just bad connection, that is main issue with machines in my experience.
Electronics Forum | Fri Mar 19 05:21:11 EST 1999 | Vinesh Gandhi
Hi Folks, Need help, on white spots/marks which we are getting after wave soldering. This problem has started only once we have shifted to the no clean flux. Prior, to this we have been using aqueous cleanable flux without problems. If brushed vi
Electronics Forum | Wed Jun 25 08:58:02 EDT 2003 | cyber_wolf
I need something that is very thin so I can screen print while the fingers are protected. We have tried cleaning the fingers prior to shipment, but our customer tells us that even alcohol leaves enough residue to cause problems.
Electronics Forum | Tue Aug 15 17:00:52 EDT 2006 | Board House
Bake your solder mask and then solder coat. If you are going to put an immersion finish like Osp, gold, tin or silver you would have to do a Micro etch to clean the copper prior to placing the surface finish. Regards, Board House
Electronics Forum | Wed Feb 01 12:57:51 EST 2006 | wheels_in_the_well
There are several makes of stencil cleaning equipment. The previous post mentioned, Aqueous Tech (www.aqueoustech.com). Others of long standing high reputation are EMC Global (www.emcgti.com), Austin American Technology (www.aat-corp.com), and Tech
Electronics Forum | Tue Apr 13 19:50:53 EDT 2004 | Dreamsniper
Thanks. That's a good Idea. But question. Can a cleaning equipment (aqeous cleaner design for low standoff height parts) be able to clean my PCB given that the PCB sat in our production floor for 1 week prior to cleaning? Will the flux stick hard ont
Electronics Forum | Wed Feb 05 11:21:24 EST 2003 | pjc
First off, get them designed out. I had this problem once and filled them with SMD adhesive and cured prior to printing. We were careful to be sure the solder lands were clean of any adhesive prior to curing. It worked out very well and we did this p
Electronics Forum | Wed Jan 09 17:03:44 EST 2002 | rob_thomas
We follow IPC-2221 recommendations for Au and don't have a problem as long as the Ni is under 150 microinches.This ensures a consistent process for us.Also we do plasma clean after SMt and prior to wirebond.That makes a big difference. Rob
Electronics Forum | Mon Feb 01 17:30:00 EST 2010 | smt_guy
can anyone share how copper is being cleaned a a PCB Fab House prior to applying HASL? thanks
Electronics Forum | Tue Aug 19 03:20:39 EDT 2008 | dlocampo
Basically, Brushing the pogo pins with dry anti-static brush will help but, cleaning it using solvents is not that advisable because it only leaves some residue that will further cause contact problems. Looking at the picture it seems that the UUT's
