Electronics Forum | Thu Dec 23 11:46:38 EST 1999 | g cronin
I am looking for a vendor for solder spheres and tack flux for BGA reballing. Preferibly on the east coast or new england area. My current distributors have them but require a min purchase of 200,000 that's a lot of balls!!!! thanks greg
Electronics Forum | Tue Sep 20 17:39:52 EDT 2005 | russ
If the balls are eutectic (63/37) You shouldn't have any problems. All of our BGA rework is performed without paste. You have plenty of solder to make the joint with the balls themselves. Be wary of cleaning however since the standoff is less.
Electronics Forum | Tue Jan 16 20:34:17 EST 2007 | davef
DAVE�S BOOKSHELF ASSEMBLER�S ESSENTIALS Title: Soldering in ElectronicsAuthor: RJ Klein WassinkPublisher: Electrochemical PublicationsISBN: 090115024XPublication date: December 1989 I know, I know. The book was written in 1989!!!! I use this b
Electronics Forum | Sat Jan 16 03:06:36 EST 1999 | Wirat S.
| | Our spec on voids is 30% ball diameter in the center. On the component to ball and pad to ball interface, we use 25%. To determine this spec, we asked around. I don't know of any studies that have been done to verify if this is OK | | | | Regard
Electronics Forum | Tue Apr 13 19:14:25 EDT 2004 | Dreamsniper
Hi DaveF, To explain. The BGA that we have is from Motorola. The solder balls of these BGA's are Eutectic Solder and processed using a NC flux (as per info from supplier). So this means that the BGA pad and solder connections had NC flux process. W
Electronics Forum | Sun Apr 18 07:01:10 EDT 2004 | Nick Prince
"Thanks for all your informative replies. I do know that Motorola is using a No Clean Eutectic Solder for their BGA's. We are in Aerospace and is using a Water Soluble Paste Flux." This statement is confusing me (not to difficult at my time of life)
Electronics Forum | Tue Oct 01 16:50:26 EDT 2002 | dragonslayr
Just checked the archives with no real success so I am asking here. Are there recommended no clean pastes for SMT reflow of BGA's? Seems to me in recent threads a pro and con issue of whether or not to use no clean for BGA's is raised. The BGA in
Electronics Forum | Fri Aug 22 15:49:40 EDT 2003 | paulm
Thanks Steve for your rather colorful and sarcastic input. If I correlate your asteroid assessment with what our QA Departments data(that tells us we are experiencing this problem about 5% of the time and I am guessing higher when we are forced or re
Electronics Forum | Sat Sep 18 12:10:19 EDT 2004 | Steve Gregory
I have a question about solder masking via's in a BGA pattern, and want to see if I'm thinking correctly about this. This problem is kind of along the same line as Carol's problem earlier. I think it's a bad idea to leave the via's free from solder
Electronics Forum | Thu Aug 21 15:10:59 EDT 2003 | paulm
Such balls (=/- 0.004)size variance can occur in a single part. If I have a ball in a part that could be (according to vendor specs) 0.008 larger than another ball the only way I can insure that the smaller ball makes contact with the paste is to hav