Electronics Forum: component and id and training (Page 3 of 80)

Heat guns and component damage

Electronics Forum | Wed Feb 01 08:12:04 EST 2006 | Chunks

OK, this is easy. You say HIGH fall out, so I can assume 25 or 50%? If so, run 10 without the heat gun and 10 with. This should show you if the heat gun process is the cause or not. If the relay is a surface mount, hand solder them on. If it's a

Heat guns and component damage

Electronics Forum | Tue Jan 31 15:15:13 EST 2006 | russ

Heat guns used improperly will definitely damage components. You must have a controlled heat gun that can be set to the max temp you want pb =215C max, Pbfree maybe 240C max. This heat gun must not be able to be adjusted or you must have total trus

Heat guns and component damage

Electronics Forum | Tue Jan 31 15:51:04 EST 2006 | russ

Relays huh? I can tell you from previous experience that relays are not a good heat gun candidate. Did you check how long this part can withstand the 240? I do not know what the 4 setting is on a liester but it is probably well in excess of the 24

Clearance between Through hole and chip component

Electronics Forum | Wed Feb 28 21:42:56 EST 2007 | davef

Very smart, Chunks.

Reflow soldering problems and traces under component

Electronics Forum | Tue Jul 19 11:52:24 EDT 2016 | oleksz

Thank you Pavel. Aleksander

Re: PCB and component handling guidelines

Electronics Forum | Wed Feb 23 18:57:58 EST 2000 | Mike Vina

I don't know if this is the real answer you are looking for, but the EIA-625 and EIA-583 standards may provide you with the depth. http://www.jedecstandards.com/

Re: PCB and component handling guidelines

Electronics Forum | Wed Feb 23 18:57:58 EST 2000 | Mike Vina

I don't know if this is the real answer you are looking for, but the EIA-625 and EIA-583 standards may provide you with the depth. http://www.jedecstandards.com/

Reflow soldering problems and traces under component

Electronics Forum | Tue Jul 19 08:26:46 EDT 2016 | pavel_murtishev

Aleksander, The answer is no. Solder deposit being printed is 80um-150um in height depending on PCB design what is two times higher than any track covered by solder mask. Molten solder will merely center the component. QFNs are prone to soldering

Clearance between Through hole and chip component

Electronics Forum | Wed Feb 28 11:43:20 EST 2007 | realchunks

Marcin, Think outside the box. If you are glueing the SMT part down, why not have an aperture cut in your stencil (or recut a stencil) between the SMT part and thru-hole. Wave solder hates SMT glue. This will get rid of your solder short problem

Pb alloy reflow temperatures and component integrity

Electronics Forum | Tue Aug 22 14:59:55 EDT 2000 | Mike Naddra

What does the reflow profile look like , the question I had was surrounding the higher reflow temperature and the max temperature that lowest thermal mass components will see. Some other questions that I had were surrounding the components , what of


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