Electronics Forum | Tue Aug 11 09:52:53 EDT 2015 | rgduval
I assume that these parts are falling off during second-side reflow? The easy solution, of course, is to not build high-mass components on first-side reflow. If this isn't practical, however, you can try using epoxy/glue under the component. We'
Electronics Forum | Wed Jun 29 18:11:13 EDT 2005 | GS
Start from this: - check the air flow speed, if too much it can help to get components moved/blowed away. - Other cause (not so often)it could be moisture in PCB, so when degassing, may be trough vias, the pressure could blow away components. Regar
Electronics Forum | Thu Jun 30 12:20:50 EDT 2005 | sumote
Its been my experience that a "dot" of glue on the center of the part is needed for "barrel" type components.
Electronics Forum | Thu Jun 30 12:27:58 EDT 2005 | kmorris
I'm not familiar with this particular oven, but have seen this problem once before. As it turned out there was a flexible curtain near the end of the reflow tunnel on the oven. Some very fine strands had frayed from the curtain and were catching on
Electronics Forum | Thu Jun 30 13:49:36 EDT 2005 | John
I had the same incident before, and like GS pointed out, the degassing from the via under the component was responsible. The via was covered with solder mask, but it burst open during the reflow.
Electronics Forum | Mon Aug 13 08:16:19 EDT 2007 | davef
Your theory is reasonable about a component issue. You need to investigate the solderability of the pads on the BGA interposer.
Electronics Forum | Tue Aug 11 09:48:22 EDT 2015 | samputrah
We have had two jobs that have the same issues with DPAK's sliding off their pads during reflow. We tried to resolve this by placing epoxy on the side of the component to create a "dam". However this is not repeatable enough to be a quality resolutio
Electronics Forum | Mon Aug 13 10:00:18 EDT 2007 | ed_faranda
Might want to check to see if the weight of your part has increased. If it has increased, you may not have enough surface tension to hold the part on the board. I am assuming you already checked that the component isn't getting hit by something in
Electronics Forum | Thu May 18 08:31:28 EDT 2006 | marc
Hi James Short answer... yes... long answer...impingement velocity is excellent for heat transfer but it also is a higher risk of moving components. Variable speed blowers allow you to reduce the speed / impingment and more than likly your compone
Electronics Forum | Tue Sep 16 10:57:01 EDT 2003 | Gabriele
Also most of Tantalum Caps are iron-magnetic material made, for sure is not this case but always wen we met problems like James met, we had always sot-23, light capacitors 0603 as you know some of them have Nikel barriel (also magnectic sensitive) an
