Electronics Forum | Tue Feb 09 16:04:06 EST 2010 | frankalbiter
Hi there, From the ISO 13485: 2003 std. standpoint, there is a special requirement which states: "The following requirements shall apply. d) If appropriate, special arrangements shall be established and documented for the control of contaminated or
Electronics Forum | Wed Jun 17 16:08:37 EDT 1998 | upinder singh
We are facing a problem of high contamination on boards after wave soldering. We want the contamination to be under 24 ugm/inch square. We are using a no clean flux with the spray fluxer unit of wave soldering. The contamination is higher on the end
Electronics Forum | Fri Dec 06 12:24:03 EST 2002 | Mike Konrad
Military and most commercial standards requires post-soldered boards to measure less than 10 �g/in of NaCl (14 when using an Omegameter, 20 on a Ionagraph, and 37 on a Zero-Ion). As Dave stated, 6.5 �g/in of NaCl is called out in Mil-P-55110 for ba
Electronics Forum | Thu Oct 05 16:04:00 EDT 2006 | GS
I am not expert, just my comment, the total ionic contamination allowed after SMT, by using No Clean process, theoretically it should be close to Zero. Any way the Standard IPC-JSTD-001 allows 1,56 ugr NaCl/cm2 for the final Printed Board assembled.
Electronics Forum | Sun Nov 27 05:06:25 EST 2011 | siaomuay
Hello I'm just study PCB in my company. I found many Surface PCB have some contaminate and can not specify what it is. Size is around 2 mm2 . Sometime I send to supplier and they said it is solder paste or some dirty flux. please see contaminate1
Electronics Forum | Fri Nov 13 20:17:35 EST 1998 | Chuck Garth
| | I believe that gold fingers on my circuit boards are being | | contaminated and need to clean them with some chemical | | solution. Any recommendations. | | | Chuck: What is the type and source of your contamination? Dave F | We are using a s
Electronics Forum | Tue Apr 06 17:01:24 EDT 2004 | davef
It doesn't make sense that contamination would form on your gold pads after prebake of 150C for 3 hrs. The contamination must have been there prior to the bake. Your description makes us think of solder mask bleed. Tell us about: * Solder mask * S
Electronics Forum | Thu May 18 10:42:41 EDT 2006 | stepheniii
I don't think so. But I want to point out the amount of lead needed to contaminate a joint is microscopic. You won't have lead vapour in your oven and with a clean oven there probably isn't any other way for even a microscopic amount of lead to con
Electronics Forum | Thu Aug 30 06:57:56 EDT 2007 | simonalden
Hi we are currently experiencing a problem with solder contamination of the gold contact pads on our pcbs following the reflow process, possibly through sputtering. We have been advise that this can be caused due to the pcbs being humid or due to th
Electronics Forum | Wed Feb 04 21:06:07 EST 2009 | shan
I'm looking for test labs in Taiwan that are capable of performing ionic contamination testing on small to medium sized SMT boards. I'm interested in both ion chromatography and ROSE test methodologies. Is anyone aware of any labs performing contami
