Electronics Forum | Fri Nov 13 23:33:33 EST 1998 | Kallol Chakraborty
| | | I believe that gold fingers on my circuit boards are being | | | contaminated and need to clean them with some chemical | | | solution. Any recommendations. | | | | | Chuck: What is the type and source of your contamination? Dave F | | We a
Electronics Forum | Sat Nov 14 08:05:54 EST 1998 | Earl Moon
| | | | I believe that gold fingers on my circuit boards are being | | | | contaminated and need to clean them with some chemical | | | | solution. Any recommendations. | | | | | | | Chuck: What is the type and source of your contamination? Dave
Electronics Forum | Wed Apr 14 19:47:13 EDT 2021 | solderingpro
Sounds like you may have already found the issue: inconsistency from your supplier. Seeing as Gold really doesnt oxidize and you're using an inert environment (N2 I suspect), I would turn my attention to the supplier. You said yourself, the "Shine
Electronics Forum | Fri Aug 21 14:38:00 EDT 1998 | Earl Moon
| It's been one hell of a week.... | From personal experience, what are the most common causes for embrittlement of the solder joint? I just need to make sure I've got all my bases covered. | thanks | -Ben Right on. Yago sangria. Chili conceso. That'
Electronics Forum | Wed Aug 26 00:16:08 EDT 1998 | Jeff Sanchez
| | It's been one hell of a week.... | | From personal experience, what are the most common causes for embrittlement of the solder joint? I just need to make sure I've got all my bases covered. | | thanks | | -Ben | Right on. Yago sangria. Chili conc
Electronics Forum | Mon Aug 27 08:03:32 EDT 2007 | davef
Actually, you will be soldering and wire bonding to the palladium layer, so we should have asked if you checked that layer, rather than the nickel. We not sure of the source of the copper that your see on EDX. It's possible copper from the pad migra
Electronics Forum | Thu Mar 18 20:08:34 EST 1999 | Steve Gregory
Are you suggesting there may be some chemical incompatibility between paste/flux chemistries and the glue being used - thus intefering with the glue's ability to bond properly? I've only heard of this possibility, but never experienced it. Justin, St
Electronics Forum | Wed Sep 18 22:53:24 EDT 2002 | davef
Please give us background on your situation, so that we can focus on the specifics, for instance: * This is a bare board problem, correct? Then, this contamination causes what the problems in your process? * What is the type [ie, FR4, CEM1, etc] of
Electronics Forum | Tue Feb 11 22:28:25 EST 2003 | davef
What do you mean by "new information"? On final module testing: * If you have hypercorroded nickel and you detect it during final testing, you'll notice it. * If you have hypercorroded nickel and you don't detect it during final testing, you'll ship
Electronics Forum | Fri Feb 21 12:49:26 EST 2003 | slthomas
Because it's not limited to one part type and he's verified his profile...what else is there, unless the profile isn't what he thinks it is? My question is, why does it stick to the boards but not the parts? Is the difference in bonding strength i
