Electronics Forum: copper and short (Page 3 of 29)

SMT Adhesive and Other

Electronics Forum | Mon Feb 11 17:19:37 EST 2008 | slthomas

Don't forget to mention Repetitive Stress Syndrome and short term disability claim costs.

Silver Epoxy and CEM3

Electronics Forum | Wed Aug 26 12:02:23 EDT 1998 | Steve Joy

Does anyone have any experience they are willing to share on Ag epoxy used as a copper through hole plating replacement? Was CEM3 used? What are the limitations? Thanks, Steve

solderability and hasl thickness

Electronics Forum | Tue Sep 09 15:10:01 EDT 2003 | swagner

Has anyone had negative experiences with hasl thicknesses below .00005'' of an inch on copper? If so could you please respond with what the problems were. Thanks in advance!!!

Inspection and splicing

Electronics Forum | Fri Jan 25 05:28:52 EST 2008 | dekiper

Hi, I think our Splice Device is the tool yiu are looking for. It can be used in high volume production for splicing in the production line OR used to splice short lenghts of carriers to a complete reel. http://www.dekitools.com/group.asp?group=664⊂

Stencil cleanliness and inspection

Electronics Forum | Thu Jun 07 13:40:12 EDT 2001 | kerryn

Dave, We have very short runs (less than one hour). We have stencils all over the place waiting to be cleaned. It is too time consuming to scope each stencil to inspect for cleanliness. Do you know of any automated or scanning devices that can ra

Inspection and splicing

Electronics Forum | Thu Oct 04 13:34:02 EDT 2007 | rgduval

I'd be happy to tell my customers that they need to provide more parts...the problem is, we specialize in short runs. So, if the customer pinches pennies, and only buys 50 pieces for 50 piece demand, I need to be able to deal with it. Hence, the

When? How and What??

Electronics Forum | Tue Aug 22 10:06:53 EDT 2000 | George English

Has there been a definite date for the total move over to lead free? Will it be 2004 or 2008. Also is there a direct replacement for leaded solder, I have read various articles on numerous alloys suggested for the switch, such as bismuth, tin, copper

solderability and hasl thickness

Electronics Forum | Wed Sep 10 12:56:09 EDT 2003 | davef

Intermetallic compounds [IMC]: * Form during the alloying process of some metals. In soldering these are Sn, Ni, Ag, Cu, Au. * Do not accept solder. * Increase in depth in logarithmic proportion to both time and temperature. [So during the solder

BGA assembly and inspection

Electronics Forum | Tue Apr 03 01:37:54 EDT 2001 | philipreyes

60% 36% 0f ball area >36% Class2 Accept Reject 45% of ball diameter >45% 20.25% of ball area >20.25% Class3 Accept

Inspection and splicing

Electronics Forum | Wed Aug 22 14:25:22 EDT 2007 | russ

Go inform the owner of your company that you are spending hours of labor dealing with these parts instead of spending the extra 4 dollars it takes to buy an entire reel. When we deal with strips we make sure that an extra amount is ordered to apply


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