Electronics Forum | Fri Nov 22 05:04:07 EST 2019 | SMTA-Matthew
We have some circuit boards where the solder mask seems clear instead of green on top of some of the tented via pads. No gold deposited during the ENiG process and no solder sticks to it but why is it clear and does it have any correlation to the thi
Electronics Forum | Tue Dec 31 17:05:20 EST 2019 | slthomas
Assuming you've already looked at optimizing your profile and stencil design, have you looked at metal load in the paste? I hadn't, but just read that increased metal load (associated with reduced powder size, i.e., moving from T3 to T4) has been sh
Electronics Forum | Wed Dec 13 18:54:59 EST 2023 | hhudson
Good Afternoon, I was wondering if anyone knew what a calibration table is for an ionograph? I have a customer asking for one and am unsure. My first though would be a table that correlates SIR values and converts them the ug/NaCl equivalence? Can s
Electronics Forum | Thu Aug 24 13:20:24 EDT 2000 | Murad Kurwa
One of our divisions is having this problem: - De-wetting on the smt pads and componenent termination on the bottom side after top side procssed through reflow. Board finish is immersion silver. ? Any recommendation on what we should check & verify
Electronics Forum | Sat Jul 22 14:35:26 EDT 2000 | Roger A. Wehage
I recently heard (but can�t remember the source) that radio receiving antennas much smaller than the quarter wavelength or so necessary to obtain sufficient signal strength were being developed. I think the process may be based on digitally correlati
Electronics Forum | Thu Mar 22 03:26:42 EST 2001 | moseschee
Hi Dave, Thank you for your reply.It means a lot to me. By the way, is it possible to have the analysed data on the study you mentioned regarding the solderability "conditioning " ? Can we establish the correlation of solder shelf life based on y
Electronics Forum | Thu Jun 14 21:06:49 EDT 2001 | davef
We rate each board for producibility. [Our rating chart may be based on some things that Bob Willis did. Check his site [http://www.bobwillis.co.uk/ ] for all kinds of neat stuff. Maybe even bring him in to help you sort through things.] There
Electronics Forum | Fri Oct 02 16:04:47 EDT 1998 | Benji Acosta
Hi Dave, Thanks for your response. HAST is an acronym for Highly Accelerated Stress Testing. Instead of the conventional PCT or Autoclave which requires say 168 hours, HAST can tremendously shorten the time. There has been correlation being estab
Electronics Forum | Mon Nov 12 16:13:48 EST 2001 | davef
Underfill is primarily used in flip chip, CSP attach applications. It is used to balance the differing thermal expansion rates for an organic board, solder, and silicon die. There are a fair number of papers written on this in the SMTA [www.smta.or
Electronics Forum | Wed Dec 11 20:40:25 EST 2002 | davef
Se�or Tech Consider the following in evaluating your adhesive: * Determine the ability to dispense/print epoxy dots over the full range of application diameters/volumes. * Assess the ability to dispense/print epoxy without undesirable characteristic
