Electronics Forum | Mon Oct 29 18:21:43 EST 2001 | slthomas
We recently have received a lot of warped (bowed and/or twisted behond IPC 600 specs.) bare boards (some our fabricator's fault, some ours by design) and I can't help but figure that long term reliability will suffer when building product with them.
Electronics Forum | Tue Oct 30 10:54:37 EST 2001 | slthomas
Hey, Preacher, choir here. Unfortunately I didn't get to make the call here (hot boards, new product, same ol' same ol'), but I dam* well am looking for future (print) backup to assist in persuading the bottom line guys that it's cheaper to wait for
Electronics Forum | Mon Oct 29 20:19:44 EST 2001 | davef
DON'T do it!!! The two problems you'll have are: 1 Poor manufacturing process control, resulting in weak solder connections. 2 Weak solder connections are stressed, when the board is straightened upon installation in the "box". There's several hits
Electronics Forum | Fri Oct 29 02:07:48 EDT 1999 | Eom In Soub
hi. guys Have you out there ever seen the crack by means of humidity after reflow solering. We cannot analyze the cause of the tsop crack. The shape of crack seem to be hitted by sharp stuff. but there is no scar around crack . TSOP shaped long rec
Electronics Forum | Mon Sep 15 06:14:49 EDT 2008 | milas
Hi Has anyone experienced laminateand BGA cracking on ENIG finish boards built using a lead free process? The laminate is cracked directly underneath the pad where the solder joint has cracked. We have confirmed the cracking via Microsectioning. We
Electronics Forum | Wed May 22 10:27:42 EDT 2019 | Matt
thanks again for the feedback were your cracks mostly visible in relation to images shown in the document here: https://www.digikey.ca/en/pdf/t/tdk/guide-flex-cracking-mlcc most of our cracking has been lengthwise across the body which from what i
Electronics Forum | Wed Jun 13 21:31:27 EDT 2001 | davef
Lotsa ways to bust caps. First: placement force; Second: thermal stress; Third: poor pad design. Forth: then, ummm maybe the cap supplier. Please describe the crack in more detail. Where does the crack start? Where does the crack go?
Electronics Forum | Fri Apr 18 16:53:25 EDT 2003 | takfire
DST, What was the crack signature? Was the crack parallel with the internal electrodes or 45� with the terminal electrode? It is also important to determine the orientation of the failed caps on the PCB (in regards to depaneling). Perhaps the cap
Electronics Forum | Thu Nov 13 09:14:52 EST 2008 | raiders
Hi All, We encounter capacitor crack in the ICT, it contributes 2% of the failure. We are not sure whether these crack coming from the SMT. All these crack having the same pattern. Please refer to attached file. Anybody encounter the same thing befo
Electronics Forum | Wed Sep 27 12:44:52 EDT 2000 | Ashok Dhawan
What could be possible resons for " Plating Crack on Barrel (tented via)" This tented via is in proximity to parts being hand soldered. The crack in barrel was detected on failure analysis - micro-section of via where barrel is having crack ( circul
