Electronics Forum | Tue Jun 27 08:08:23 EDT 2000 | Christopher Lampron
Hello All, My question is in regards to repackaging moisture sensitive components. I have researched the archives and found alot of valuable information. We currently have a heat sealing machine but do not have the capability of evacuating the bag pr
Electronics Forum | Fri Jan 21 18:47:14 EST 2000 | Ashok Dhawan
This massage is for clarifications on storage and handling of Moisture sensitive parts: Does chip resistors,capacitors and inductors need vacuum packing during usage life? For repacking of FPDs to limit reuse, is it necessary to use vacuum seler or s
Electronics Forum | Wed Nov 12 09:32:30 EST 2008 | markhoch
Are there better options? Dude, EVERYTHING else is a better option. Gluing aluminum foil down to the bare copper would be a better option. ENIG (Electroless Nickel Immersion Gold), Immersion Silver, Immersion Tin, and OSP all provide flatter surfac
Electronics Forum | Tue Mar 13 08:04:28 EDT 2007 | Cmiller
We have used thousands of them with no problems. They will not aid in "connector retention" unless you have a shear force at exactly the right angle. This is an advertising joke. They will help with alignment of the connector. Open your holes up so t
Electronics Forum | Fri Jun 23 08:52:16 EDT 2000 | Dave F
John: Seek your answers in the archives. As I recall someone said: � Biggest cause of BGA shorting was out-gassing in-package moisture. � Removing shorts w/o removing the device: - Preheat the board - Lower the nozzle and heat the device - Lift the
Electronics Forum | Wed Jun 21 18:51:34 EDT 2000 | John
What is the most likely causes of shorts in the corners of BGA devices?. Is there a method of removing single shorts without removing the device?. John.
Electronics Forum | Sat Aug 28 08:41:12 EDT 1999 | Tom Tellinghuisen
Wolfgang, We also tried to find generic 'guidelines' for Moisture Sensitivity levels. It would be a perfect world, if you could say that all PLCC84's were level 4 devices. Unfortunately it is not that easy. Moisture sensitivity levels are
Electronics Forum | Mon Feb 26 14:06:09 EST 2001 | marting
We have just started to be involved with collumn grid array devices and are currently placing them by Universal GSM machinery. We have been advised by Universal that they supply "On Axis" cameras designed for visioning CGA devices, however the cost i
Electronics Forum | Wed Jun 02 07:15:49 EDT 1999 | SC
I am currently sourcing equipment to mount CSP devices. I have looked at the GSM Flexjet & also the Siemens 80 F series. However these machines only look for ball presence not ball deformation. Panasonic are the only ones who have a 3-D camera capabl
Electronics Forum | Thu Aug 26 08:54:17 EDT 1999 | Dave F
| Having implemented the process of handling moisture sensitive devices our logistics department tries to classify all parts according to their moisture level. | Going through datasheets wasn�t that helpfull, so does anyone know of a source for that
