Electronics Forum: double and reflow and off (Page 3 of 8)

Re: Cracking Capacitors and Solder Balls

Electronics Forum | Mon Jun 08 15:29:17 EDT 1998 | Gary Simbulan

| Earl, et al, | Boy things get old and cold around here fast. I promised more detail on my capactior problem and I thought I could drop something completely different in the same message and tell a tale of solder balls. | First the caps. We stil

Re: Cracking Capacitors and Solder Balls

Electronics Forum | Mon Jun 08 14:52:16 EDT 1998 | Gary Simbulan

| Earl, et al, | Boy things get old and cold around here fast. I promised more detail on my capactior problem and I thought I could drop something completely different in the same message and tell a tale of solder balls. | First the caps. We stil

Re: Cracking Capacitors and Solder Balls

Electronics Forum | Tue Jun 16 15:01:58 EDT 1998 | Gary Simbulan

There are some common reason for capacitor cracking on my web page if you want to have a look. The document can be downloaded for your reference. | Earl, et al, | Boy things get old and cold around here fast. I promised more detail on my capactior

Foam fluxer maintenance, storage and cleaning

Electronics Forum | Mon Nov 09 09:44:22 EST 2015 | davef

Purpose. This describes setting-up a wave soldering system set-up for a new assembly design or checking a wave solder machine operation with a test board. Applicability. To be used for new design printed circuit assembles and during machine accept

BGA ball and PCB pad

Electronics Forum | Wed Feb 18 12:42:43 EST 2004 | babe

OK, if the sphere of the ball and the paste on the pad are both eutectic, 63/37 then the paste will reflow first causing a drop of the component, after which the spheres will reflow causing a double drop and a good intermettalic. You can see this by

Water cleaning and Moisture Entrapment

Electronics Forum | Wed Dec 24 11:23:22 EST 2008 | childs

I can't seem to locate any information/concerns about moisture entrapment in IC packages on the promary side in a double sided SMT assembly using water soluable solder paste when soldering the second side. A typical process would assemble/reflow/cle

Re: BGAs and vapor phase

Electronics Forum | Mon Jul 19 12:37:15 EDT 1999 | Wolfgang Busko

| | | | | Hi, SMTASSY | | | | that�s what we do, soldering our double-sided-finepitch-BGA-and all-the-other-stuff-boards in vapourphase because it�s the only thing we have. | | First, we do not do real series produktion, only prototyping up to som

SOT23s and paste + glue

Electronics Forum | Mon Dec 22 11:09:21 EST 2008 | mfcat

We changed paste manufacturers rather recently and are now seeing SOT23s falling off after wave solder. These parts have a dual process... we stencil print paste, apply glue, populate then reflow. Only SOT23s fall off, chips are fine. We do not be

Heat guns and component damage

Electronics Forum | Wed Feb 01 22:27:16 EST 2006 | KEN

Many relays use soldered post coil terminatins inside the relay. In one case many years ago I found the SMT relay manufacturer used eutectic solder inside their hermetic relay. The SMT relay would fail because the solder balled up on the post, woul

Re: BGAs and vapor phase

Electronics Forum | Tue Jul 20 05:29:14 EDT 1999 | Wolfgang Busko

| | | | | | | | Hi, SMTASSY | | | | | | that�s what we do, soldering our double-sided-finepitch-BGA-and all-the-other-stuff-boards in vapourphase because it�s the only thing we have. | | | First, we do not do real series produktion, only prototypi


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