Electronics Forum | Mon May 20 11:58:41 EDT 2002 | JoAnn
Greetings! The SMTA will be offering a course on this topic at SMTA International in Septmber. If you want a complete overview of this course please check out http://www.smta.org/smtai. Hope we might get to see you in September. JoAnn
Electronics Forum | Tue Feb 04 00:07:10 EST 2003 | MA/NY DDave
Hi David F Now I clicked on Phil's site and only got the front page. How do I or others get to the beef of this particular topic. Phil is funny and fast YiE, DDave
Electronics Forum | Mon Aug 13 08:00:46 EDT 2007 | davef
Are the components that fall from the board solderable? Is the board solderable? Where is the solder for the components that fall from the board [eg, on the pads, on the component]?
Electronics Forum | Thu May 09 16:04:07 EDT 2002 | stownsend
The lighter the component, the more likely it is to stick to the solder on the bottom reflow side. All boards I have worked with, the descrete components (R's and C's) are placed first (bottom side), reflowed, then the active components (IC's) are pl
Electronics Forum | Wed Jun 21 22:07:09 EDT 2000 | Jason
We are going to try double sided reflow for the first time. Can we use the same 63/37 paste on both sides? The board also has bare copper pads i'm pretty sure. will this present any challenges? The bottom side has a QFP on it. Should it stay on?
Electronics Forum | Thu May 16 11:37:13 EDT 2002 | fmonette
My company offers a simple and cost effective control system for MSDs on the factory floor. It is a turnkey solution to comply with J-STD-033. If you want more information feel free to contact me offline. Francois Monette Cogiscan Inc. Tel : 450-53
Electronics Forum | Mon Feb 03 18:37:28 EST 2003 | jonfox
Not to be off-topic, but push engineering for embedded passives and remove parts from the underside all together. Watch the material cost sky rocket, but watch the manufacturing cost sink and well as improve the production cycle by 50%. Sorry, I w
Electronics Forum | Mon Feb 03 20:23:48 EST 2003 | davef
Use the pad mating to lead wetting area. Check: * Phil Zarrow's site [ http://www.itmconsulting.org ] for a paper. * Bob Willis may have something on his site [ http://www.bobwillis.co.uk ]. He has been very involved in developing this measure. * F
Electronics Forum | Mon Aug 13 16:07:08 EDT 2007 | dyoungquist
We run double sided surface mount boards through our Heller oven without any parts falling off the bottom side unless they are too big/heavy. The trick we use is to set the bottom side temperature in the final 3 heat zones 10C-20C lower than the top
Electronics Forum | Mon May 13 10:37:56 EDT 2002 | fmonette
The other important issue relates to moisture sensitive devices (MSD). If you have MSDs on the first side, you need to track the remaining floor life of the components on the partially assembled boards between the first and second reflow. Contrary to