Electronics Forum | Mon Oct 25 15:56:56 EDT 1999 | Dave F
William: Three things: 1 If the gold is porous, it will not protect the nickel and the nichel wiil oxidize and become unsolderable. 2 If the nickel is not solderable, the gold overcoat will not improve that. 3 Ag or Au over electroless Ni creates b
Electronics Forum | Fri Jun 19 14:25:24 EDT 1998 | Earl Moon
| | Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. | | Mike | There has b
Electronics Forum | Mon Nov 13 21:24:19 EST 2006 | davef
You said your gold processing is immersion. More importantly, what is the process used for your nickel? Electroless correct? What is the percent by weight of phosphorus found in your analysis? How many times was the nickel plated? [You should be a
Electronics Forum | Mon Oct 20 15:41:19 EDT 2008 | patrickbruneel
Josh, You can not check the bare boards for black pad unless you remove the gold plating. Like Robin said black pad is nickel oxidation/corrosion and a result from bad electroless nickel plating bath control. The only preventative action you take is
Electronics Forum | Mon Nov 04 07:31:54 EST 2019 | amitthepcbguy
As a manufacturer, I prefer plated nickel gold, electroless nickel immersion gold, immersion silver and palladium. These surface finishes are the best options to replace leaded surface finishes. These surface finishes can withstand higher temperature
Electronics Forum | Tue Feb 01 21:51:05 EST 2000 | Dave F
Roni: Ron gives good advice on the thickness of your Electroless Nickel - Immersion Gold (ENIG) solderability preservative. Several additional comments are ENIG: � More expensive than OSPs and HASL. � Much flatter surface than HASL, similar to OSP
Electronics Forum | Fri Aug 11 14:50:35 EDT 2000 | Doug Philbrick
Any Motorlla Guru's out ther know, or can say, if Mot is mandating a change away from Gold / Nickel and going to OSP where BGA are involved?
Electronics Forum | Tue Aug 21 22:24:36 EDT 2001 | davef
Root around here http://www.kns.com/resources/library/lib-wirebonding.asp
Electronics Forum | Thu May 02 07:11:10 EDT 2002 | davef
They probably the same. Most likely someone is saying immersion gold [immersion Au] as a short hand for ENIG [ Electroless Nickel - Immersion Gold]. It is very uncommon to plate gold directly on copper, because gold and copper form a brittle interm
Electronics Forum | Mon Feb 21 09:05:46 EST 2005 | davef
We're try to stay away from using electroless nickel. Please describe the differences between the IMC.
