Electronics Forum | Tue Nov 07 21:49:05 EST 2000 | Dave F
Cheers to you Your gold plating is specified for the gold wire bonding between the die of your BGA and the pads on the BGA substrate. For solderable surfaces this is heavy on gold for use on pads. Gold SB thinner on pads to limit the amount of gol
Electronics Forum | Mon Oct 25 16:35:04 EDT 1999 | William
I am pretty sure I am not having a problem w/porous gold or nickel that does not solder. How about electroless versus electrolytic? I thought electrolytic was for goldfingers and such applications. Can you use electrolytic plating for fine pitch a
Electronics Forum | Tue Oct 07 02:18:13 EDT 2003 | iman
Hi Experts, Pls help advise what is the expected range of PCB gold thickness over Ni (for ENIG/Electrolytic fabrication processes)? any referrence standards set by the IPC?
Electronics Forum | Tue Dec 13 22:58:43 EST 2005 | Mike Kennedy
Dave, I have read an article by Vern Solberg who said that Electro plating Ni/Au in not recommended for PCB's. I have tried his email but get bounce back. Do you know him or his email? I knows its a long shot to ask you, but it never hurts to ask...
Electronics Forum | Wed Aug 24 08:50:59 EDT 2005 | davef
First, while black pad can be a problem with poorly controlled electroless gold [search SMTnet Archives for background], it is not a suffiecient reason to use electrolytic. It's the reason the supplier should fix their electroless gold process. Se
Electronics Forum | Tue Feb 03 16:42:50 EST 2009 | cuperpeter
Hello All, > > I have a problem with nonwetting Au > finish after second cycle of reflow soldering > doublesided boards. Solder nonwetted pcb pads (is > wicked to component terminations) Either these > pads or some of non component pads became
Electronics Forum | Mon Aug 10 11:28:19 EDT 1998 | Justin Medernach
| Is there any problem using SMT on gold boards? 15 years ago we were told not to use gold boards, but I can't remember why. Judging by the other postings it now appears to be common. Only problem I see is that the nickel should be plated, not ele
Electronics Forum | Mon Aug 28 12:41:35 EDT 2000 | JAX
MoonMan, I'll take a crack at the list. Feel free to answer the ones I don't! 1. Solderability is a parameter which indicates how well a component can be soldered. As far as Solder Termination Coatings go, here are some up�s and down�s of a few. Ha
Electronics Forum | Sun Jan 25 17:40:16 EST 2009 | cuperpeter
Hello All, I have a problem with nonwetting Au finish after second cycle of reflow soldering doublesided boards. Solder nonwetted pcb pads (is wicked to component terminations) Either these pads or some of non component pads became discoloured from
Electronics Forum | Mon Oct 25 15:56:56 EDT 1999 | Dave F
William: Three things: 1 If the gold is porous, it will not protect the nickel and the nichel wiil oxidize and become unsolderable. 2 If the nickel is not solderable, the gold overcoat will not improve that. 3 Ag or Au over electroless Ni creates b
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