Electronics Forum | Thu May 22 14:44:10 EDT 2008 | samir
Does your top-side preheat NEED to be that high, and so high that you are exceeding the flux manufacturers' spec? If so, what is the reason? Top-side wetting? Are you measuring this temperature at the substrate or solder joint?
Electronics Forum | Wed Jun 21 09:12:42 EDT 2017 | emeto
I would start with checking the flux amount and trace and the thermal profile(preheating is important) for this assembly. Then I would consider changing to another flux and run it again.
Electronics Forum | Thu May 22 16:52:39 EDT 2008 | tonyamenson
Indium got back to me with the attached PDF. I always assumed, that in order to avoid thermal shock, there could not be any more than 80 degrees C difference between the solder pot and the pre-heated board. However, it would seem that any thing le
Electronics Forum | Mon Jul 19 12:37:15 EDT 1999 | Wolfgang Busko
| | | | | Hi, SMTASSY | | | | that�s what we do, soldering our double-sided-finepitch-BGA-and all-the-other-stuff-boards in vapourphase because it�s the only thing we have. | | First, we do not do real series produktion, only prototyping up to som
Electronics Forum | Tue Nov 02 05:00:28 EST 2004 | jysam
we are using solder paste WS609 and OM5100.Relow oven: forced convection type. For WS609 and OM5100, straight ramp up profile is suitable for low to medium thermal mass assemblies and preheating may be required for high thermal mass assemblies. How
Electronics Forum | Tue Jan 16 07:51:19 EST 2007 | realchunks
Your Quality Manager won't let you make changes, yet you get blammed for process problems? First, you need a change in management. Second, if you can't change set pre-heat temps, change the conveyor speed. Slow it down and see if your joints loo
Electronics Forum | Mon Aug 24 03:59:26 EDT 2009 | hurr
Hallo Joanne, I had employed by producer of Ecofrec 303. We make many tests of corrosion and conductive test in our company. All results of this tests was OK . Vast majority correspond mil standarts. When I ask my labor assistent in BRY, white residu
Electronics Forum | Mon Jul 19 11:11:18 EDT 1999 | Wolfgang Busko
| Perhaps a little hard to find but is there anyone who uses a vapor phase process to solder populated card with BGAs. I am interested in the success rate of such a process. It is obvious that the throughput is reduce vs a convection oven but still t
Electronics Forum | Fri May 22 17:48:48 EDT 2015 | aemery
It's your first line, go with established manufacturers. Whether new or used it ultimately comes down to does the tool do the job and how well is it supported (labor/parts) if it does break down. I am a former field eng. with Speedline and now run
Electronics Forum | Tue Jul 20 05:29:14 EDT 1999 | Wolfgang Busko
| | | | | | | | Hi, SMTASSY | | | | | | that�s what we do, soldering our double-sided-finepitch-BGA-and all-the-other-stuff-boards in vapourphase because it�s the only thing we have. | | | First, we do not do real series produktion, only prototypi
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