Electronics Forum | Mon Jun 11 22:00:19 EDT 2001 | davef
IPC-A-610 uses words to the effect that it�s a Class 2 process indicator, if either: * Entrapped or encapsulated solder balls that are within 0.13 mm [0.00512 in] of lands or connectors, OR * Entrapped or encapsulated solder balls exceed 0.13mm [0.00
Electronics Forum | Tue Nov 07 00:33:40 EST 2017 | aqueous
If no-clean flux is reflowed correctly, many of the activators are encapsulated within the resin residue left behind after reflow. An ionic contamination test cannot differentiate between ionic residue that was encapsulated (not harmful) and residues
Electronics Forum | Mon Jul 16 15:49:33 EDT 2001 | Steve
The solder balls you are talking about are caused by too much paste. Reduce the size of the stencil aperatures. Concerning removing the solder balls, the first thing you need to ask yourself is, do I need to remove them. IPC-610, 12.4.10 states, "Ac
Electronics Forum | Wed May 25 18:09:47 EDT 2005 | Fluxed_State_of mind
Need some input here..... The fear is that the if we use water soluble flux at the repair operation, that the no-clean encapsulation will capture some of the organic material as it cools down and goes to its original state. The organic material wil
Electronics Forum | Tue Dec 28 03:59:06 EST 2010 | riscy00
I'm investigating heat transfer by 1st order approximation between PCB and ambient air via encapsulate material (epoxy or gel or silicone), they have thermal conductivity of 0.2W/C but it hard to find specific heat capacity and density. Has anyone
Electronics Forum | Wed Feb 25 11:37:01 EST 2015 | jasonnova
We have a customer with an assembly that will require potting using 3M DP-270. There is a component that needs to be covered with potting material but it is considerably higher than the overall potting height of the cavity. The low viscosity of the
Electronics Forum | Wed Jun 07 10:49:38 EDT 2000 | John Thorup
Dave - let's not forget Dainippon's Novolac epoxy. This is the stuff that caused us so much grief with IC shortages years ago when their factory was damaged and it turned out they were the world's major supplier of molding compounds. This also spaw
Electronics Forum | Thu Dec 03 13:39:52 EST 1998 | Russ M
| | | | I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure
Electronics Forum | Mon Jul 20 04:19:01 EDT 1998 | Michael Jeremias
Who knows something about the reliability of plasti PEMS and its enhancemant by application of conformal coating (Parylene, metal, SiO2, SiNxOx, etc.) ?
Electronics Forum | Tue Apr 02 08:33:43 EST 2002 | davef
No experience, but here's a contact http://www.cooksonsemi.com/tech_art/pdfs/Ultimate%20FC-Integrated%20Flux_UF.pdf They may be able to give you leads, if someone here doesn't.