Electronics Forum: enclosed and flow (Page 3 of 7)

CSP and BGA soldering difference.

Electronics Forum | Fri Apr 06 08:45:48 EDT 2007 | davef

UNDERFILL The design of the component and the end-use environment drive the requirement fot underfill. Here is a good introduction: http://www.asymtek.com/news/articles/2002_globaltronics_csp_and_fcuf.pdf Google for more. We have no relationship, n

paste Sn42/Bi58 and Lead Finish

Electronics Forum | Fri Nov 02 14:46:18 EDT 2012 | ericrr

So how does this (lead free paste Sn42/Bi58) solder compare with the Sn-Ag-Cu (Tin-Silver-Copper) combination which does not flow as well (in the oven), needs higher oven temperature, (that can be adjusted by reducing the oven chain speed) and cost m

Stencil and board Ultrasonic cleaner

Electronics Forum | Wed Feb 01 13:46:05 EST 2006 | Chunks

Sounds like a epididymis! It depends on your paste chemistry. You can't just slap any old saponifier in there. Most water based cleaners evaporate the water and you have to remove the dried paste. It's a bit messy, maybe that's why your's is over

SN100C alloy positive and negatives

Electronics Forum | Wed Dec 24 15:28:17 EST 2008 | edmentzer

We use SN100C for wave soldering and hand Lead free soldering and have had very good results. The wire cored solder for hand soldering flows good and makes very good solder joints. The SN100C in the wave solder machine also works very good. We use

01005 components and reflow profiles

Electronics Forum | Tue Apr 10 04:16:20 EDT 2012 | grahamcooper22

you are seeing a typical issue that is caused when such small volumes of paste are printed....there are several reasons for it..the tiny amount of flux in the small deposit becomes exhausted much quicker then it does in a larger deposit ( the flux ma

CIM systems and Final Assembly

Electronics Forum | Mon Jan 22 15:01:32 EST 2001 | aiscorp

CIM systems for electronics assembly have traditionally considered the PCB only. Final assembly "modules" are often attached to traditional systems to accommodate this common requirement for pre-PCB assembly, mechanical assembly, and final assembly

Coils and Water Soluble Fluxes

Electronics Forum | Wed Oct 10 13:51:08 EDT 2007 | petep

Coilcraft has posted the following and I am wondering how you folks are handling the use of coils in a Water Soluble world. PCB Washing and Coilcraft Parts Coilcraft tests for resistance to solvents per the following specification: Resistance to s

Re: SMD Inspection and Touch-up

Electronics Forum | Fri Jul 23 13:09:48 EDT 1999 | Steve

| There is a practise within the industry of an Inspector inspecting a board, and that same Inspector performing touch-up. My opinion is that the Inspection and Touch-up operations should be separate functions whereby the Inspector is not performing

silicone conformal coat and electrical contacts

Electronics Forum | Fri Feb 02 08:36:14 EST 2007 | CK Flip

Wow, I cut first cut my teeth in the Industrial motor control industry. My 1st company made motor control products like variable speed drives, solid state overload relays, soft starts, etc. and in our shop, we used nothing BUT Dow Corning silicone p

Conductive contamination and the elusive solution

Electronics Forum | Mon Jul 16 08:42:14 EDT 2007 | realchunks

Hi Scott, Here is another thought. Check your wave solder machine visually. Does the wave flow on both sides of the nozzle? If not, you may have some dross build-up which may be causing your problem. Generally it will only happen on the very fir


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