Electronics Forum | Tue Apr 12 19:31:39 EDT 2005 | davef
Tell your fab that you'd like your ENIG according to IPC-4552. Just so that you know, IPC-4552 ENIG specification: * Ni thickness: 3 - 6 microns [120 - 240 microinches]. * Au thickness: 0.075 - 0.125 microns [3 - 5 microinches]. * Recommended spec
Electronics Forum | Wed Dec 28 03:33:31 EST 2005 | sparrow
I would like to know if ENIG is widely used for the thermosonic gold wire bonding or this application is an exotic one. And I also wold like to talk to someone who uses printed circuits with ENIG finish for such an application. I do not quite underst
Electronics Forum | Thu Jul 24 22:37:06 EDT 2008 | davef
As part of the IPC-4552 specification testing, they ran ENIG at 2 uinches for 1.5 million cycles for a membrane-type keypad application [there was no testing for the wiping-type switches]. They stopped testing when the membrane began breaking down. T
Electronics Forum | Sat Nov 03 11:08:24 EDT 2012 | anvil1021
We have experience with this alloy, but with enig and we did start with PB HASL, none of our PCBs would of course pass thermal cycling at normal temperatures with the HASL so we went to ENIG. we could thermal cycle at 100-115C with no issues. We foun
Electronics Forum | Fri Feb 17 09:08:22 EST 2017 | davef
An interesting paper on the topic is "The evolution of surface finishes in mobile phone applications" by Claus Würtz Nielsen at Nokia Mobile Phones R&D [http://www.cicmt.org/adv_micro/papers/Nordic2004paper.pdf] The paper reported corrosion problem
Electronics Forum | Thu Nov 10 12:29:57 EST 2022 | stephendo
The G in ENIG is gold. It does not oxidise. Either you are thinking of OSP or your board shop is providing defective boards if your boards show oxidation. It would be the nickel that is oxidising but should be totally covered by the gold. Is there
Electronics Forum | Fri Feb 11 15:33:52 EST 2000 | Steve Thomas
We're considering an ENIG finish on some of our boards to resolve some coplanarity concerns with 20 mil pitch QFP100s. I welcome any comments on the subject, especially regarding solderability and the variables of ENIG that affect it, but would part
Electronics Forum | Mon Jul 26 09:19:57 EDT 2004 | davef
Both imm silver and ENIG provide flat surfaces that are better for fine pitch placement and reflow than HASL. We know of nothing that makes BGA locations different than other locations when using ENIG solderability protection. More broadly, the pri
Electronics Forum | Sat Mar 15 09:30:29 EDT 2008 | davef
Unlike other solderability protection, immersion coatings [eg, ImAg, ImSn, OSP, etc] can be reworked by the board fabricator prior to assembly operations. Reasons for selecting immersion are: * Until a supplier can demonstrate that they can turn bla
