Electronics Forum | Thu Nov 30 16:10:05 EST 2006 | Hussman
Wow, why all the anger? This gap you guys are talking about is measured as "G" in IPC/EIA J-STD-001 (Chunks was there, but she failed to read the fine print). And almost all parts that measure G follow Note 3 which states "Properly wetted fillet s
Electronics Forum | Wed Nov 29 10:10:50 EST 2006 | M. Sanders
I'm sorry, Dave - I didn't make myself very clear. Yes, this space (not really a "gap") is filled with solid solder. For instance, if you place a gull-wing component in solder paste, after reflow, there will probably be a thin film of solidied solder
Electronics Forum | Wed Jan 07 17:39:26 EST 2015 | duchoang
Additional info: I use SAC305 solder paste on Enig PCB.
Electronics Forum | Wed Nov 06 10:03:59 EST 2013 | rgduval
Hi, Peter, I'm not an authority on surface finish thickness, and it's effect on reflowing, so, I can't advise on that front. If the boards are a week old, and ENIG, I would not suspect surface contamination. It's always a consideration, of course,
Electronics Forum | Tue Jun 07 20:17:09 EDT 2022 | SMTA-64387182
Understood, Thanks, Joe
Electronics Forum | Thu Jun 02 14:23:36 EDT 2022 | SMTA-64387182
We are designing a new PCB that will include a 0.4 mm WLCSP IC package. The OEM’s application-note for this package states ENIG; Au
Electronics Forum | Fri Jun 03 15:19:32 EDT 2022 | dwl
I don't recall thicknesses off the top of my head but brittleness becomes an issue more for gold plating then ENIG. .125 um should be fine. also, gold ain't cheap so its unlikely your PCB fab will get anywhere near the max tolerance. On the other e
Electronics Forum | Wed Jun 08 23:04:26 EDT 2022 | SMTA-64387544
Au thickness of 0.125 um should not cause solder joint embrittlement. Also, PCB fab should offer Au thickness range between 0.05-0.075 um for better process control and reliability. Higher Au thickness may suggest black pads leading to solder joints
Electronics Forum | Thu May 13 09:52:34 EDT 2021 | winston_one
Want to update this question a little, I know it appears few years ago, but I hope there is some updates... We have to assembly few samples of motherboards with this kind of finish (customer mistake during pcb order). Normally we can use leaded sold
Electronics Forum | Wed Oct 02 15:20:55 EDT 2002 | Eric
Is there a steadfast rule of thumb for a good solder joint on an Enig Gold board. I come across this number 217C when discussing BGA profiles. Is this a published number? I sure could use a reference. Anybody feedback is appreciated.
