Electronics Forum | Thu Feb 08 12:16:05 EST 2001 | Antonio
I wasn't specific which type. But all this info helps. Thanks a bunch fellas...
Electronics Forum | Mon May 10 18:43:23 EDT 2004 | steve davis
Just curious what stencil company are you currently using? What style of aperture are you using for the componet?
Electronics Forum | Thu Jul 05 10:45:01 EDT 2001 | dougie
Steven, There is a load of info on this if you check through the archives. Quick pointer though are: Solder balls are caused by paste creeping under the component at placement. The part is placed and the paste is squashed under the component, when t
Electronics Forum | Mon Jul 16 14:48:16 EDT 2001 | mparker
Just received "Circuits Assembly", July 2001 issue. An article regarding solder balls and aperture design, beginning on page 40. This DOE had aperture, reflow profile and no clean pastes (3 types) as attributes. It is advocated that a U-shaped a
Electronics Forum | Wed Feb 07 21:56:00 EST 2001 | davef
Every critter out there with large incisors adapted for gnawing and nibbling has a different theory of solder ball formation. [My theory: It�s punishment for using NC fluxes. Stand and deliver. My solder balls end-up in the gross filter connected
Electronics Forum | Thu Feb 08 11:06:36 EST 2001 | pr
You oven guys are SOOOO sensitive! I must agree though, the oven profile made nowhere near the difference that the Homeplate did, in our place.
Electronics Forum | Tue Jul 10 03:14:19 EDT 2001 | winnifred
Steven, Dave is right, wash them away. Since it is RMA paste, you may need to have a saponifier to go for Semi-aqueous washing. Or you may want to contact your supplier for a cleaner to wash it away with some agitation ( ultrasonic). Mag.
Electronics Forum | Wed Jul 18 02:05:30 EDT 2001 | winnifred
Steve, To clean the RMA processed boards, u hv to make sure u talk to the supplier first, then get the right saponifier and do semi-aqueous cleaning.
Electronics Forum | Thu Jul 12 10:32:59 EDT 2001 | Hussman
Wow, what a string of answers and nobody brought up the easiest way to eliminate solder balls. Yes, the paste being squished under the part does reflow and work it's way out to the side during reflow. I did a 5 week study on this (when I was a bori
Electronics Forum | Fri Jul 20 10:35:34 EDT 2001 | slthomas
David, I've thought about doing this also with no clean boards that were poorly cleaned following a misprint (and subsequently reprinted, populated, and reflowed) but have shyed away because of the potential for damage to components from the ultraso
