Electronics Forum: equipment process (Page 3 of 128)

selective solder process attributes

Electronics Forum | Fri Nov 14 10:40:35 EST 2014 | eniac

I use a two machines from EBSO, Germany. It's a machines with PCB carrier, so, solder pot is fixed. I'm fully satisfied with this equipment, but I use only wettable nozzles. If you would like to buy a new machine, not in used condition, EBSO will be

Re: MicroBGA qualification process

Electronics Forum | Thu Mar 30 21:46:56 EST 2000 | Dave F

Reg: This is copy / paste from draft version of IPC 7095 ( issued May 1999 ) ... 7.3 Assembly accept/reject criteria 7.3.1 Voids in solder joint a. Sources of Voids There can be voids in solder balls, or at the solder joints to the BGA, or at the so

seeking better process

Electronics Forum | Fri Mar 16 08:38:40 EST 2001 | ctech

C-Tech is the 8th fastest growing company in New Jersey, yet we are so small and can not afford to buy expensive assembly equipment. Currently in production, we have 8 different through-hole boards and 1 surface nount board. In the past we have had

seeking better process

Electronics Forum | Fri Mar 16 08:51:24 EST 2001 | ctech

C-Tech is the 8th fastest growing company in New Jersey, yet we are so small and can not afford to buy expensive assembly equipment. Currently in production, we have 8 different through-hole boards and 1 surface nount board. In the past we have had

Reball BGA process flow

Electronics Forum | Wed Feb 02 13:05:51 EST 2005 | russ

Process flow 1.Remove part - It may be necessary to bake assembly prior to removing. 2.Remove remaining solder from part 3.Apply flux to part 4.Apply solder spheres to part 5.Reflow part You may want to bake component before re-installing 6.Apply

seeking better process

Electronics Forum | Fri Mar 16 16:58:52 EST 2001 | davef

A most evocative title to the tread, Ed. Few companies in Joysee named "C-Tech", eh? I assume we�re talking "C TECH is a distributor of low vision aids and adaptive technology for the blind, visually impaired and learning disabled." [http://www.lowv

BGA process requirements

Electronics Forum | Thu Apr 11 18:47:43 EDT 2002 | slthomas

A couple of questions to establish a baseline for when the check writers start asking questions........ How many of you have vision systems on site for BGA inspection? If you don't have it, do you do 100% X-ray, or did you just nail down the proces

Note for cleaning process

Electronics Forum | Thu Jun 26 20:54:08 EDT 2008 | davef

As pointed-out above, the downside of telling your supplier how to perform a process can create problems: * It sets the cost of the operation ... I did what you told me to do * Materials selected may be incompatible ... I did what you told me to do *

Placement equipment capability study ?

Electronics Forum | Wed Nov 21 11:30:48 EST 2007 | cyber_wolf

Has anyone been involved in SMT placement equipment capability studies? I was wondering if anyone has procured used equipment and performed capability studies on the equipment and received quality and cost benefits from the resulting data. They

cpk measurement on fuji equipment

Electronics Forum | Wed Jul 04 12:22:07 EDT 2001 | davef

Several points: * Consider that your Cpk is probably different for both placing large and small components. * Probably your routine placement rate SB the speed you use to monitor the accuracy of your process. * Some people use a calibrated glass test


equipment process searches for Companies, Equipment, Machines, Suppliers & Information

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