Electronics Forum: ersa and offset (Page 3 of 5)

Thin Chip resistors and HSP 4797 T12W8P

Electronics Forum | Wed May 21 15:47:34 EDT 2003 | JB

We have an HSP 4796, if the feeder mechanism is the same, this may help you a bit. First make sure that the componet definition is right on the component library. Tape or Embossed. Second, the component thickness vs actual thickness. Is the pick u

Yestech B3 Capacitors and P+P downtime

Electronics Forum | Thu Apr 07 09:24:47 EDT 2011 | rway

What version of sw are you running? There are some new features in 2.7.7 and earlier that may be of benefit to you. With chip caps you are testing for presense/absense. The gain/offset feature can be used to give you better contrast between the pa

Your opinion about RoHS and WEEE ?

Electronics Forum | Fri Dec 24 05:12:08 EST 2004 | Patrick Tavernier

Hi ! Thank's for your replies. I'm seeing you're very concerned about this subject. I think RoHS and WEEE arrive too soon. Not technological solution about whiskers and tin pest. RoHS implicates a lot of money for to implemente news process. We must

Die placement with MPA-G3 pick and place

Electronics Forum | Thu Jun 06 07:53:51 EDT 2002 | Jim M.

Has anyone had much luck Picking and Placing die with a Panasonic MPA-G3?What special setups or considerations are required? Currently we pick and place one die with our Universal GSM using only one nozzle. The nozzle must be painted white in order

Pick and Place vs CAD File

Electronics Forum | Sat Sep 23 21:52:51 EDT 2017 | jlawson

In most cases PnP files are all that is needed for SMT program generation. BUT, it depends on origin reference of this data as exported to PnP and could be off in X,Y and rotation of image pending when PnP Data is exported. Also Rotation of parts

Solder Paste and fine pitch components

Electronics Forum | Wed Sep 18 12:31:16 EDT 2002 | dragonslayr

My suggestion is to conduct a Design For Manufacturing (DFM)study on the assembly in question. Pay particular attention to the pad sizes, component lead dimensions and satisfy yourself that those two factors are correct. Given that pads match compone

Simultaneous pick up with 0402 and 0201 components

Electronics Forum | Thu May 05 19:13:33 EDT 2016 | darby

Thanks Sr. If you have zero tolerance for simul pick up in your component files then you will not have simul pick up due to variances in your head offsets. So you are saying that on your Juki you run a tolerance for 0201? All other head positions at

Simultaneous pick up with 0402 and 0201 components

Electronics Forum | Fri May 06 07:58:33 EDT 2016 | cyber_wolf

Darby, I'm not completely sure I understand. Juki machines have what is referred to as a multi-head. The offsets between the heads are the same as the spacing between 8mm feeders. So the (6) heads all come down at once and "gang pick" from 6 8mm fee

Volume and average height of solder paste after printing machine

Electronics Forum | Thu Oct 02 12:22:26 EDT 2008 | JerryS

Hello Ok there is not much info here. What you have to mae sure of is several key factors. 1. Have you entered the correct stencil thickness. 2. Are you using the stencil gerber (not the paste layer) The paste layer is usually not adjusted for ap

Simultaneous pick up with 0402 and 0201 components

Electronics Forum | Thu May 05 01:50:44 EDT 2016 | darby

Dear Forumites, It's been a while, but I have a question. I was recently asked to provide a scenario on capacity if we retired two older lines and replaced with a new line. My capacity figures were based on real time production over a period of six


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