Technical Library | 2007-08-09 12:23:10.0
Recent developments in No Flow-Fluxing Underfill (NFFUF) products have demonstrated their utility to enhance the reliability of flip chip assemblies with reduced processing steps over conventional capillary flow methods. This basic work considered processing conditions such as dispensed volume and placement force, speed and dwell time. Further evaluations of these new products on a variety of flip chip assembly configurations manufactured by various processes have been undertaken to provide further evidence of their suitability and potential in high volume electronic manufacturing. This paper summarizes the recent evaluations and discusses new studies of additional assembly configurations, which include higher input/output (l/O) counts up to full arrays in excess of 1200 l/Os.
Industry News | 2014-05-16 14:31:53.0
While dip soldering of through-hole components has long been an easy and affordable way to automate manual soldering processes when the costs of wave soldering cannot be justified, these latest enhancements increase quality and repeatability to a degree that make Auto-Dip systems ideal for virtually any short-run, batch application.
Industry News | 2018-04-18 18:12:03.0
MicroCare Europe bvba will showcase its newest electronics cleaning products at the SMT Hybrid Packaging Show in Nuremberg, Germany. The expo runs from 5-7 June 2018. These new circuit cleaners will help companies boost quality, enhance throughput and lower PCB production costs. They also will help clients meet ever-more stringent European regulations
Industry News | 2018-05-01 19:37:14.0
MicroCare Europe bvba will showcase its newest electronics cleaning products at the SMT Hybrid Packaging Show in Nuremberg, Germany. The expo runs from 5-7 June 2018. These new circuit cleaners will help companies boost quality, enhance throughput and lower PCB production costs. They also will help clients meet ever-more stringent European regulations
Industry News | 2023-04-24 19:35:42.0
Silicon Mountain has upgraded its selective soldering department with four new selective solder systems from Pillarhouse International. The company continues to invest to maintain the flexibility, quality, and turnaround necessary to meet each customer's unique needs.
New Equipment | Solder Materials
The TMT-TC-2 Tip Tinners is a compressed tablet of pure tin and ammonia phosphate formulation in a metal container with lid. It has a self adhesive pad on the underside to allow it to be affixed on, or near the work station. Removes tip oxidation
Industry News | 2008-01-08 14:27:06.0
A new generation of forced hot air lead-free CR reflow systems that meet the high temperature and tight process control requirements of lead-free while occupying up to 30% less floor space, are now offered by Manncorp.
Industry News | 2010-09-26 16:12:24.0
STI Electronics, Inc., a full service organization providing training, electronic and industrial distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, announces that its BGA Reballer Kit allows components to be reused.
Industry News | 2003-04-07 11:00:15.0
The innovative VPI-1000 optical inspection system is the only benchtop SMT inspection system capable of inspecting BGA devices as standard, without necessitating a lengthy lens reconfiguration.
New Equipment | Wave Soldering
Solder Recovery System Turns Dross into Dollars. The Solder Recovery System enables PCB manufacturers to recycle solder onsite directly from their wave solder machines. The EVS by Sono-Tek solder recycling system saves up to 50% in solder costs in
