Electronics Forum: expansion (Page 3 of 22)

SMT Product Line Expansion

Electronics Forum | Fri May 06 21:46:14 EDT 2005 | Infinity

Thanks alot. It sure helps, I am going to look into details.

SMT Product Line Expansion

Electronics Forum | Fri May 06 21:49:46 EDT 2005 | Infinity

Thanks for your advice. I agree with carrying both high end and low end tools. Thanks!

SMT Product Line Expansion

Electronics Forum | Sat May 07 05:49:27 EDT 2005 | Infinity

Any more referrals? Useful links? email: inno_finity@yahoo.com

PCB Expansion (Y & X-axis)

Electronics Forum | Mon Sep 26 14:03:26 EDT 2005 | slthomas

duplicate post, sorry

Re: CTE mismatch

Electronics Forum | Fri Sep 15 16:37:49 EDT 2000 | Dave F

Sounds like someone aimin� fo tha big hurt, if ya axes me. Two spots to place your lawn darts are: 1 J Hwang in "Modern Solder Technology � " states (p.354) that " � extreme CTE mismatch between silicon IC (~2) and the PCB (~16), solder connections

Re: gold fingers over wave

Electronics Forum | Fri Jan 14 09:36:49 EST 2000 | Richard

If the gold fingers are pad types which plug into expansion slot connectors, I have used a titanium guard attached to the wave conveyor over the solder pot, which allows the PCB to connect to the fingers but masks the solder from the gold pads along

Thermal testing

Electronics Forum | Wed Jun 23 13:56:56 EDT 1999 | Stan Frul

Hi Could anyone tell me where i can find information, in the literature or on the Web, concerning measurements of temperature distribution, expansion, stresses in the substrate and heat sink and on the interface between them, that is all the range of

FR4 vs Ceramic mismatch

Electronics Forum | Tue May 05 17:01:25 EDT 1998 | bob

I hear that there is a problem with using ceramic parts that are sizeable. Apparently, there is a mismatch in the Temperature Coefficient of Expansion between the FR4 and ceramic materials which causes the soldered erminations to weaken and eventuall

Strategic Investment

Electronics Forum | Tue Jan 20 16:24:54 EST 1998 | GEM Group

We are looking for an attractive SMT company which could benefit from a direct investment for funding expansion of capacity or value-added product lines. Please contact Florencio C. De Teresa at (212) 582 - 3400.

Baking time for PCBA rework

Electronics Forum | Tue Apr 23 16:46:14 EDT 2002 | retronix

I would sugest the lowere the baking temperature the better, the main cause of popcorning is the water expansion and this is greatest as the water boils, 100 degrees, better to elongate the time. Matt


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