Electronics Forum | Fri Oct 18 07:14:51 EDT 2002 | cyber_wolf
Have you tried using a paste with a more aggressive flux? Our main paste is Indium, but whenever we run into oxidized parts or have soldering problems due to oxidation on pads we use an older Alpha WS paste called WS609. The drawback of this paste is
Electronics Forum | Sat Jun 26 15:26:10 EDT 2004 | russ
I am very happy with Alpha Metals WS709 or even WS609. Almost all of our product is Immersion gold and we place down to 16mil pitch every day along with 0201 and uBGA. Immersion gold from my experience, solders extremely well with every paste I hav
Electronics Forum | Tue Jan 29 19:47:36 EST 2008 | davef
Bruce Barton: We're not intending to suggest that anyone is purposely leaving WS flux residue on the board after cleaning. Fact is, Arun isn't sure if the boards are completely clean. Arun said, "We haven't tested the substrate for cleanliness." Gi
Electronics Forum | Tue Jun 07 10:24:59 EDT 2016 | davef
wlsmt: You’ve got to help us out here: * Why did you apply solder paste to capacitors prior to water washing the PCBA [where the caps were attached?]? * Did you reflow the Alpha WS-609? * How is the Alpha WS-820 involved in this? * Talk about the
Electronics Forum | Fri Feb 11 05:44:08 EST 2000 | Dean
Sounds like black pad to me. I just suffered this last week. Track your fab lot codes. Just in case. I processed 1000 fabs of 2 lot codes through 1 line (also WS609). 1 lot code failed with black pad the other did not. With one common mfg. proc
Electronics Forum | Thu Dec 07 11:38:04 EST 2000 | Dason C
Please advsie what kind of the solder paste which you are using and we have experience when using Alpha WS609 and found a lot of foaming. Beside, are you using the spray fluxer for your wave or not? If you have spray fluxer then you don't need to u
Electronics Forum | Tue May 23 22:23:20 EDT 2000 | JAK
Hi all, I'm would like to try intrusive reflow (pin in paste, paste in hole, etc.) on a connector using WS-609 solder paste (halide free, water-washable). I'm concerned about entrapped flux in the barrel of the solder joints. If there were to be e
Electronics Forum | Tue May 23 22:21:13 EDT 2000 | JAK
Hi all, I'm would like to try intrusive reflow (pin in paste, paste in hole, etc.) on a connector using WS-609 solder paste (halide free, water-washable). I'm concerned about entrapped flux in the barrel of the solder joints. If there were to be e
Electronics Forum | Mon Sep 20 14:53:24 EDT 1999 | Doug
I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. The stencil is 6 mil thick, laser cut and electo-polished. The apertures are 12 mil in diameter with 20 mil pitch. We are using Alpha
Electronics Forum | Wed Apr 09 10:17:28 EDT 2003 | ksfacinelli
http://picturecenter.kodak.com/share?invite=ZExr4tzrmmYeI5Uozhlo Here is a link to the pictures. This is a HASL board with ws-609 paste. Lead parts look good but would like to see a shinner joint in the BGA area. Thermal profile looks good 150-15
