Electronics Forum | Mon Feb 21 12:02:58 EST 2000 | K. Ckak
Hi Dean, Can you please tell me how we could incorporate DPU to DPMO? Also, can you please explain the deviation factor DPU * deviation factor = DPMO ? Should we take dollar value or number of joints? Explain with calculations if you please. Thanks
Electronics Forum | Mon Oct 23 14:05:08 EDT 2000 | Aokilab
Hi Soza: As Dave F mentioned, there are lot of factors involving the formation of residue, after cleaning. Factors, (such as: solvent's cleaning power, presence of metal oxides, type of soldering flux, etc...). One thing pretty sure, IPC is usually
Electronics Forum | Fri Feb 25 16:04:18 EST 2000 | Dave F
Sze-Pei: Are talking BGAs here? Flux type? Profile? Pad material? Aperture size? We won�t want to give people too many hints on what the problem is would we? BGA voiding is a function of materials, methods, environment, and human factors. Con
Electronics Forum | Sun Jun 04 14:14:24 EDT 2000 | James.L
1) Adhesive dispensing -number of dot per component , what's the determined factor ? What's the distribution ? 2) What is the critical factor to monitor the consistacy of volume & profile per dot ? 3) What is the effect of temperature/balance of adhe
Electronics Forum | Tue Nov 12 19:55:14 EST 2002 | davef
Recognize that the cost of production changes substantially with factors such as: * Product maturity. * Production volume. * Product complexity. * Quality versus cost functions. So, in your benchmarking effort, consider baselining your data accordin
Electronics Forum | Wed Jul 16 21:38:27 EDT 2003 | sam
I have done a DOE on the SMT components, not the BGA, for reducing void within the solder. The result did not help in the void reduction, but confirmed that the speed of the IR oven, solder paste thickness may be the important factors for the void.
Electronics Forum | Mon Jul 09 11:59:25 EDT 2007 | sck1971
Does anyone have any industry standard yield factors to load at the component level to account for set up scrap and machine waste during production? I'm assuming there are different percentages used for each package size (0402, 0603, SOIC8, etc) but
Electronics Forum | Tue Oct 12 05:46:12 EDT 1999 | Brian
| Thank you all for your replies. I guess my age in this industry is showing. This military spec. does not appear to be in existance. So, let me make my request a little more to the point: | | Is anyone aware of a specification specifically refer
Electronics Forum | Fri Jan 28 12:29:01 EST 2005 | Bob R.
We use the exact same method Chunks outlined for evaluating just about anything we're going to roll out worldwide, whether it's a material or a machine. List your factors (print speed, solder spread, etc), assign each a weight, evaluate each paste a
Electronics Forum | Tue Sep 06 09:20:50 EDT 2005 | Bob R.
We approached it the same way we select SnPb pastes. We started by doing coupon level tests to sort out the obvious "bad" pastes: SIR, wetting, solder balling, print quality, etc. That cut the field in half. From there we started to do assembly l
