Electronics Forum: failed pull test (Page 3 of 60)

Can dye and pry test reveal which solder joints fail first?

Electronics Forum | Mon Jul 07 09:47:50 EDT 2008 | davef

Dye & pry test reveals the solder connections that have failed prior to performimng the test.

Relying on AOI for sensor boards - EOL for functional test

Electronics Forum | Mon Jul 30 12:45:00 EDT 2018 | mdkmdr

Trying to get a sense of the push-pull going on between designers and manufacturers on the subject of 'one test point per net'. Getting a feeling like the new paradigm is doing all of the electrical tests as functional at EOL and relying almost comp

SMT Component Design Requirements

Electronics Forum | Fri Oct 18 17:47:37 EDT 2002 | russ

What is the determination of poor soldering fails pull test, non-wetting, visual)? I have never heard of an SMT component that has leads higher than the body of the component. Refer to IPC 782 3.6.1.7 it provide the guidelines for SMT standoff heig

BGA void removal

Electronics Forum | Mon Sep 30 20:41:25 EDT 2002 | jason

Hi, The acceptance level for voids is 25% and most of it on your case should be the paste. If you want to reduce / eliminate it, you gotta have the Production to practise FIFO for the usage of the paste. If it is expired paste or exposed to long

Atmel QFP's

Electronics Forum | Thu Dec 06 10:15:14 EST 2007 | 18424

I am looking for people that are having problems primarily with test of their product after reflow/production. Has anyone experienced a great solder joint but the component still fails test? Has anyone had dewetting of atmel components, pull back of

DEK fine pitch autoflex pin breakage

Electronics Forum | Fri Mar 19 19:05:27 EST 1999 | Earl Moon

Folks, I think we are getting closer to being very happy with DEK stencil printers of the 265 GSX variety. However, problems continue arising concering fine pitch autoflex tooling pin breakage. We are told by the British engineering establishment,

solder strength

Electronics Forum | Fri Sep 02 09:02:10 EDT 2005 | dougs

you tell me, the customer has started to pull at some of the leads of some IC's with tweezers while de-bugging boards that had failed in the field, he was able to pull some of the leads away from the solder joints, we feel he may be over-doing it a

ESD Flooring

Electronics Forum | Tue Feb 28 13:28:29 EST 2023 | markhoch

If you decide on an epoxy floor, make sure you use a contractor that is experienced with installing ESD epoxy floors. The epoxy needs to be continuously mixed to keep the media consistent throughout. We had a contractor who failed to do that, and wh

Pull Test

Electronics Forum | Tue Mar 10 09:13:06 EST 1998 | Olivier de Brouwer

Is there any pull test specifications, or other test to verify the adherence of SMT inductors ?


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