Electronics Forum | Tue May 10 10:30:57 EDT 2005 | HOSS
One failure mode we have seen with TH XTALs is shorting from one of the leads to the metal can that houses the part. Typically, the opening around the lead at the base of the part can be small and if you combine this with a larger than needed annula
Electronics Forum | Wed Sep 19 17:36:16 EDT 2007 | slthomas
Like davef mentions, there are guidelines for both design and fabrication, not to mention assembly (which from the original post doesn't appear to come into play here). Not that I could improve on what dave has already shared, but it would be nice t
Electronics Forum | Wed Feb 12 22:02:47 EST 2014 | rober864
Has anyone ever encountered contaminants from the immersion silver process, whether it be from the board house or not...as it relates to conformal coating. The failure mode is severe de-wetting of acrylic conformal coating. All over solver resist, to
Electronics Forum | Fri Dec 27 13:16:18 EST 2019 | slthomas
Can you describe the failure mode of the soldering defect, i.e., is it failing to meet the height requirement for a castellated termination due to not wetting of the component terminations, or not wetting the pads sufficiently, or....? We install a
Electronics Forum | Thu Dec 22 15:21:52 EST 2022 | stephendo
I seriously doubt it. I have never heard anyone even ask about that. What failure mode exactly are you looking at? If by chance you have found ceramic capacitors on assemblies that have failed due to cracks, it wasn't because the reel was dropped b
Electronics Forum | Wed Jul 22 16:00:24 EDT 1998 | David A. Pinsky
| Who knows something about the reliability of plasti PEMS and its enhancemant by application of conformal coating (Parylene, metal, SiO2, SiNxOx, etc.) ? We have performed failure analyses on PEM's in our lab for many years. The vast majority of pa
Electronics Forum | Tue Oct 05 16:02:04 EDT 2004 | Bryce
I am curious if anyone can help explain to me the cause of an effect we are seeing with some failed caps. The parts have been found to be cracked and in most cases are hard failures (capacitance well out of spec and DCR less than 100 ohm or shorted)
Electronics Forum | Wed Jan 03 11:14:26 EST 2007 | realchunks
What is your biggest failure mode? You root cause problem could be anything from poor ICT fixture to bad incoming inspection. Generally, BGA's are a high yield producing component. Just cause they're neat-o doesn't make em' bad. As for 85% yiel
Electronics Forum | Thu Aug 13 12:23:39 EDT 2009 | robhs
Thanks Dave. What you say makes complete sense. We ran a job a short while back in this way (though without bonding) and found we had a much higher than normal failure of the BGAs which I can only attribute to the secondary reflow. As I have only got
Electronics Forum | Mon Feb 21 11:22:21 EST 2000 | K. Ckak
Hi Kurt, I agree with Dave F. I had exact same problem with PBGA placement. We requested our PCB vendor to plug/tent via (button printing) after HASL with SR1000 which worked well in the long run. There are couple of failure modes associated wit
