Electronics Forum | Wed Jan 03 10:34:18 EST 2007 | dphilbrick
Your failure rate should be as good or better than any other leaded part on your board. Have you done a reflow profile on this board. We typically sacrifice a board and drill a hole from the bottom and then imbed a probe under the part to get the tem
Electronics Forum | Tue Jul 03 09:13:18 EDT 2001 | rstodd
I work for a memory module manufacturer and I am interested in obtaining information on typical first-pass yield numbers and failure rates in the memory module industry for benchmarking purposes. Any information provided would be greatly appreciated
Electronics Forum | Tue Mar 20 23:30:57 EDT 2007 | TRACY M
Yes, but you can expect a 20%+ pickup failure rate. Chuck-based alignment was so 1990's.... :)
Electronics Forum | Tue Sep 18 07:24:55 EDT 2007 | hussman
Is there a guideline for the manufacturing of PC Boards? I find that my board changes dramatically from board house to board house, causing about 2% failure rate.
Electronics Forum | Tue Sep 18 07:25:32 EDT 2007 | hussman
Is there a guideline for the manufacturing of PC Boards? I find that my board changes dramatically from board house to board house, causing about 2% failure rate.
Electronics Forum | Wed Apr 26 09:20:43 EDT 2006 | PWH
I've seen failures like this with multilayer parts that seem to be affected by high activity flux during SMT (water soluable in this process). High, high failure rate in our case. I'm not sure what was going on with our parts but we thought maybe t
Electronics Forum | Thu Jul 18 08:54:49 EDT 2002 | Mark S.
How do you capture the workmanship details on a "per joint" basis? I have recently implimented first pass yield in SMT but it is based on the whole part and not the number of joints. And yield is calculated by PCB failure rate..a PCB with a solder b
Electronics Forum | Wed Jul 23 17:07:27 EDT 2003 | dbdavis
Dear Colleagues, I'm am experiencing some problems with nonwetting of primarily 0603 packages. The problem is infrequent but occures just enough for my QA dept. to notice. My reflow profile seems to be correct and the vast majority of parts solder f
Electronics Forum | Tue May 10 15:44:24 EDT 2011 | davef
From your graph, we just don't see the the relationship between failures and relative humidity. Questions are: * What is the correlation between failures and RH? [We'd bet that the correlation between failures/RH and failures/temperature are 'similar
Electronics Forum | Wed Nov 01 13:44:50 EST 2000 | Thomas Ballhausen
Using convection type reflow we observed following problem: One ball of a 313-PBGA appears to be dewetting. This happens randomly, i.e. no specific ball location, failure rate is rather low (3-4%), but since there are 12 PBGAs on one board the failu
