Electronics Forum | Fri Jun 25 08:44:01 EDT 1999 | Graham Naisbitt
| We are anticipating switching from RMA to OA flux for both reflow and wavesolder in the next few months. If you use a batch cleaner running DI water only I would like to hear your experiences. How is it for cleaning under low standoff components
Electronics Forum | Wed Jun 23 06:26:07 EDT 1999 | Graham Naisbitt
| You may want to rethink using an inline for both OA and No-Clean applications. Since the majority of your applications are OA, it would not make a lot of economic sense to run saponifier in your inline for a minority application. My suggestion is
Electronics Forum | Thu Apr 17 16:43:09 EDT 2003 | davef
Background: * Bulwith, Ronald A., �Failure Analysis of Solder Joints�, �Insulation/Circuits� magazine, February 1978 * Banks, Donald R., et al., �The Effects of Solder Joint Voiding on Plastic Ball Grid Array Reliability�, Proceedings of the Technica
Electronics Forum | Wed Mar 02 06:19:03 EST 2005 | pjc
Go to http://www.ipc.org and look up IPC-7351 - Generic Requirements for Surface Mount Land Pattern and Design Standard The successor to the IPC-SM-782A is here! The document covers land pattern design for all types of passive and active components
Electronics Forum | Thu Mar 10 09:13:15 EST 2005 | davef
From http://www.IPC.org ... IPC-7351 - Generic Requirements for Surface Mount Land Pattern and Design Standard The successor to the IPC-SM-782A is here! The document covers land pattern design for all types of passive and active components, includ
Electronics Forum | Thu Jun 23 13:50:07 EDT 2005 | Erik
Paul, I'm quite frankly relieved, I thought I was the only one with these thoughts! We have only had our Rheometric pumps since February, but since then our process has been difficult to control with fine pitch applications. And then there's always
Electronics Forum | Wed Jan 11 18:10:26 EST 2012 | davef
New Webinar on Laser Depaneling SMTA Webinars On February 9th, Josh Brown of LPKF Laser & Electronics will walk you through the advantages and disadvantages of laser depaneling in comparison to more traditional methods of depaneling such as routing,
Electronics Forum | Tue Apr 10 09:28:54 EDT 2012 | davef
Here's information from Bob's ppm site ... ||Screen Printing||Component Placement||Reflow Soldering||Wave Soldering May ‘02||730||15020||448||18251 June ‘02||569||7103||678||3366 July ‘02||3977||2998||1227||3736 August ‘02||1430||1229||108||4314 Sep
Electronics Forum | Wed Jul 06 15:33:36 EDT 2016 | davef
Please explain how you would go about grounding a circuit board EOS/ESD Association Frequently Asked ESD Questions 16-Threshold Volume 26, No. 1 January/February 2010 Q. I have a customer that wants us to measure our compressed air for static. Ho
Electronics Forum | Wed May 24 17:49:51 EDT 2000 | Keith Luke
SMTneters, The end of May finds several recent publications from leading publishers on my desk. I am all too happy to share these books with our loyal SMTneters in the hopes that they will provide us with a timely review of the new release. For ma
