Electronics Forum | Tue Aug 05 08:33:06 EDT 2003 | Mike Stadt
Is jet dispensing of highly filled polymers possible? I have only seen applications with SMT adhesives, where the filler content is on the order of 10%.
Electronics Forum | Tue Feb 24 09:52:14 EST 2004 | davef
First, two points about hole / barrel fill are: * A filled hole is an excellent indicator of the optimum process and optimum quality PCB. * The study that showed that holes need not be filled was paid for by the US Army and performed by Lockheed in
Electronics Forum | Fri Oct 08 07:38:48 EDT 2004 | Paddy
Hello, I am wondering if anybody has process experiance of designs which use the above. I understand that the filled via is an excellent thermal cnductor, which is great from a design point of view, but how do these solder through the reflow ovens
Electronics Forum | Wed Nov 30 12:44:54 EST 2005 | ppwlee
Dave, Do you know if such thermal transfer study with CB-100 (or equivalent) is available for review? My customer is pursuing this option and I am curious on how much improvement I would see by specifying a conductive via fill on the board. Rgds, P
Electronics Forum | Tue Mar 22 08:05:59 EST 2005 | jdumont
Morning all, my question is regarding the use of filled/tented/plugged vias on the BGA site. What are you guys doing for this? What type of issues can this cause if using none, or the improper via design. Regards, JD
Electronics Forum | Tue Oct 07 11:39:04 EDT 2008 | sliebl
We use high temp (K&pton) tape on the bottom side of the stencil. This works well for us as an interim fix prior to replacing the stencil. I'd be interested to know if there are permanent methods of filling the apertures that can be done in-house.
Electronics Forum | Mon Dec 21 14:38:11 EST 2009 | bandjwet
Does anyone know of a vendor of "black top" to fill in voids left by laser "X-out" patterns in the top of an epoxy (plastic) package ? We are demarking an area of a device and would like to fill it in with something other than a colored epoxy. Reg
Electronics Forum | Thu May 20 14:38:09 EDT 2010 | davef
Unfilled vias consistently produce higher quantities and larger voids than filled vias, in some cases 5 times as much. [Effect of Filling Via-in-Pad on Voiding Rates in PWB Assembly for BGA Components; C Shea, R Raut, L Piccione; ALPHA -A Cookson Ele
Electronics Forum | Wed Dec 19 09:41:14 EST 2012 | dyoungquist
What is your solder pot temperature? We found that on a 0.093" multilayer board increasing the temp of the lead free solder from 300C to 315C helped with the barrel fill.
Electronics Forum | Tue Jul 30 14:51:38 EDT 2013 | dyoungquist
How full is the barrel actually getting? Per IPC-A-610, 100% fill is the target but 75% fill is acceptable for Class 1, 2, and 3.
