Industry News | 2014-07-28 08:03:55.0
Techcon Systems has introduced a new brochure entitled, “Medical Device Assembly Process Key Factors to Consider.”
Industry News | 2015-04-02 10:42:02.0
Great Lakes Engineering, a distributor of Henkel Solder Paste and a cutting edge manufacturer of surface mount stencils, precision laser cut parts, photo chemical machined parts, and Lucon Squeegee Blades, is breaking into the electronics industry in a big way.
Industry News | 2018-06-17 16:55:59.0
SHENMAO America, Inc. is pleased to introduce its PQ10 Low Temperature Solder Paste. As the world’s major solder materials provider, SHENMAO produces SMT solder paste, laser soldering paste, cored solder wire, wave solder bar, semiconductor packaging solder spheres, wafer bumping solder paste, flux and solar PV ribbon.
Industry News | 2018-07-08 18:45:56.0
SHENMAO America, Inc. today announced plans to exhibit at the SMTA Ohio Expo & Tech Forum, scheduled to take place Thursday, July 12, 2018 at the Embassy Suites Cleveland Rockside. Company representatives will showcase the new PQ10 Low Temperature Solder Paste.
Industry News | 2019-04-15 06:42:26.0
SHENMAO America, Inc. is pleased to announce that it will exhibit at the 2019 IEEE Electronic Components and Technology Conference (ECTC), scheduled to take place May 28-31, 2019 at The Cosmopolitan of Las Vegas. The company will showcase its PQ10 series low temperature solder paste in Booth #500.
Industry News | 2019-05-20 18:51:08.0
SHENMAO America, Inc. introduces PF735-PQ10 Low Temperature Solder Paste. Qualified by a third-party organization, the PQ10 series of low temperature solder paste is made with a modified Sn/Bi alloy that has a lower melting point range from 137°~142°C to 137°~170°C. This makes it ideal for SMT devices, which can have sensitive components that cannot withstand higher temperatures.
Industry News | 2019-06-16 19:33:20.0
Super PCB is pleased to announce that the company offers high density interconnect (HDI) PCBs. HDI products have a higher wiring density per unit area than traditional PCBs and offer faster transmission, less signal loss, fewer delays and are more compact.
Industry News | 2023-02-27 18:10:50.0
SHENMAO America, Inc. has released its PF735-PQ10-10L Low Melting Point Lead-Free Solder Paste. The paste has been designed specifically for the SMT process and is applicable to the high-speed printing process to increase production capacity.
Industry News | 2008-06-03 15:08:51.0
COLORADO SPRINGS, CO � June 3, 2008 � FINE LINE STENCIL, a division of FCT Assembly and a leading manufacturer of stencil products, announces the availability of LPKF Laser Technology/SMT Stencil Laser Technology.
Industry News | 2009-10-02 18:24:04.0
Everett Charles Technologies announces that Jim Brandes, Product Manager, will hold a presentation titled “Kelvin Contactors for Wafer-Scale Test” at the upcoming International Wafer-Level Packaging Conference and Tabletop Exhibition, scheduled to take place October 27-30, 2009 at the Santa Clara Marriott in Santa Clara, CA. The presentation will be held during Session 16, “WLP Reliability and Test,” which is scheduled to take place Friday, October 30, 2009 from 3-5 p.m.
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