Electronics Forum | Thu Feb 04 10:25:03 EST 2016 | tombstonesmt
Have you re-visited your paste manufacturers profile requirements? Start there, adjust accordingly to critical components on the boards (ie LED's, moisture sensitive, etc..).
Electronics Forum | Fri Feb 05 11:37:07 EST 2016 | steprog
Thanks for that, I will look into it. Unfortunately the plant is in Sweden, however maybe I can get a sample from someone local there. Do you have any contacts?
Electronics Forum | Fri Feb 05 13:08:01 EST 2016 | steprog
Thats funny, maybe so. Anyway, changing the ramp rates will probably be the first thing we will try next week in Sweden.
Electronics Forum | Mon Feb 08 14:58:57 EST 2016 | steprog
Hi, Can you let me know how I can talk to you about this product? I need to talk to the company pretty quick Thanks, Greg
Electronics Forum | Wed Feb 03 22:05:24 EST 2016 | mac5
Our company being an automotive supplier is all > about quality control, not a clean room > requiremen, This is a no clean process, all > surface mount boards and Solitec ovens. > Hopefully this answers your questions. Greg Hi Greg, Are you
Electronics Forum | Fri Feb 05 04:14:43 EST 2016 | grahamcooper22
HI Greg, you may want to consider trying a paste especially developed to minimise splattering. I work for Almit and we offer a paste called SPM ( SPlatter Minimiser)...it is widely used for applications where no splattering is required. Take a look a
Electronics Forum | Fri Feb 05 09:13:13 EST 2016 | emeto
Hello Greg, there are several things to be considered: I will start this investigation in the oven. Look in your cooling zones. Many ovens build up a lot of flux there(especially the ones with water cooling) and should be cleaned every so often.
Electronics Forum | Wed Feb 03 15:29:33 EST 2016 | sarason
Have you ever done QC type thinking on your problem or are you aware o fthe methodology? Do you run your plant in a clean room environment? Do you clean after reflow? If not Why? What sort of products are you running? What sort of oven are we ta
Electronics Forum | Fri Sep 08 00:24:35 EDT 2000 | Jim Arnold
Sudden flux boil will cause splatter. More thorough drying or a slower intial ramp to allow drying to occur before a boil or "splatter" temperature is reached may aid your problem.
Electronics Forum | Wed Aug 23 15:19:11 EDT 2000 | Dr. Ning-Cheng Lee
From solder material point of view, a solder paste with slow coalescence rate, or slow wetting rate, will be most desirable. Processwise, allowing the paste to stay at soaking zone for longer time will dry out the volatiles, and reduce the chance of
