Electronics Forum: fr4 baking (Page 3 of 6)

Polyamide

Electronics Forum | Mon Feb 15 14:30:00 EST 1999 | Dave Turner

Any info on the pros and cons of FR4 or Polyamide ref the use of soldering PGAs would be helpful. ie. temp co-efficient diffs, baking, wave soldering, Convection reflow etc

HASL, shelf life, IPC standards

Electronics Forum | Wed May 03 16:37:10 EDT 2017 | charliedci

I don't believe there should be any issues with the HASL finish. The issue is how long on the shelf and is a bake out required to remove moisture from PCB, as in any FR4 PCB's that may have had time to absorb moisture.

Re: FR4 vs Polymide

Electronics Forum | Fri May 15 18:13:35 EDT 1998 | Earl Moon

Does the temp. profiles used to reflow double sided pcb's through a IR oven on FR4 board material have to be re-established if it is changed to polyimide? Boards will be baked out prior to assembly. any response would be most appr

Do yo have to bake unused bare boards or just Vacuum Pack?

Electronics Forum | Thu Aug 24 15:54:13 EDT 2006 | davef

It depends. What is: * Storage environment and period * Board laminate, epoxy, and copper thickness of PTH * Down stream process * Etc FR4 0.062" thick boards absorb between 0.08 to 0.1%Wt of moisture within a 24 hour period, and 0.2 to 0.23%Wt in

Re: Bakeing

Electronics Forum | Mon Nov 27 17:39:37 EST 2000 | Dave F

Daniel: In response to your questions: * Moisture level (wt%) that may cause delamination in PCB�s. - Certainly, it depends, but 100% moisture will not cause delamination of a PCB. [Now, heating that water is another question, isn�t it? ;-)] *

Flex Circuit Assembly Process (Sitiffeners)

Electronics Forum | Fri Oct 01 08:15:02 EDT 2010 | rgduval

Is the stiffener a piece of FR4, or a component that needs to be installed? We've done a number of flex assemblies taht have a rigid stiffener, generally a piece of rigid flex, or FR4 that has the components mounted on it. This type of stiffener

HASL, shelf life, IPC standards

Electronics Forum | Mon May 15 12:36:12 EDT 2017 | edhare

I don't believe there should be any issues with > the HASL finish. The issue is how long on the > shelf and is a bake out required to remove > moisture from PCB, as in any FR4 PCB's that may > have had time to absorb moisture. > I don't believe

Re: MLB PCB DIMENISIONAL STABILITY AND LAMINATE INTEGRITY

Electronics Forum | Fri Mar 06 12:54:37 EST 1998 | Earl Moon

We have been told that we should bakeout FR4 boards prior to assesmbly - i gather from your discussion that you disagree - any details will be sincerely appreciated. Regards. Please bake. I agree. Let me know how we have a disagreement.

Water Residue Stains - how to remove?

Electronics Forum | Wed Dec 19 01:17:13 EST 2001 | ianchan

Hi Experts, I need help here, advice appreciated from all... Production is running a Lot of flex-circuit PCB, through the SMT line, with 0402 components. The flex-PCB is taped to FR4 support "pallets" when processing thru' the SMT P&P m/c. We use

PCB Baking

Electronics Forum | Fri Feb 28 01:10:32 EST 2003 | MA/NY DDave

Hi I don't know what FR4 you are using, so check it out to make sure 125 isn't too high. I have seen this done occassionally when the PCBs have bad moisture or other problemx where baking helps prior to assembly and solder, yet I haven't seen it do


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