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Package on Package (PoP) Stacking and Board Level Reliability, Results of Joint Industry Study

A Practical Guide to Achieving Lead-Free Electronics Assembly

Electrical Performance of an Organic, Z-interconnect, Flip-Chip Substrate

Influence of Nanoparticles, Low Melting Point (LMP) Fillers, and Conducting Polymers on Electrical, Mechanical, and Reliability Performance of Micro-Filled Conducting Adhesives for Z-Axis Interconnections.

Optimizing Flip Chip Substrate Layout for Assembly

Fundamentals of Solder Paste Technology

Testing Digital Designs - The Boundary-scan Balance

Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear Force

Enterprise-wide Supplier Quality Management: The Big Payoff for Global SPC

A New Stenciling Method for Reworking SMT Components

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Selective soldering solutions with Jade soldering machine

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The 2024 IPC Certifications Schedule is Here. Train In-Person, Online or On-Site. EPTAC is the Leader in Electronics Manufacturing Training with 24 Locations across North America.

2024 Eptac IPC Certification Training Schedule

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