Electronics Forum | Fri Apr 06 08:45:48 EDT 2007 | davef
UNDERFILL The design of the component and the end-use environment drive the requirement fot underfill. Here is a good introduction: http://www.asymtek.com/news/articles/2002_globaltronics_csp_and_fcuf.pdf Google for more. We have no relationship, n
Electronics Forum | Fri Nov 08 14:05:36 EST 2002 | slthomas
I have....they lay down copper strips every 10 feet or so , attached to house ground, then glue down the carpet. The glue is filled with carbon filaments, as is the carpet itself.
Electronics Forum | Wed Jul 29 12:58:35 EDT 2015 | pankyb1261
Is there anyone that makes a pick and place glue dot for surface mount chip components (B stage epoxy dot in a carrier tape)? Thanks, Rich
Electronics Forum | Fri Aug 27 10:25:52 EDT 1999 | Matthew Park
Is it feasible to have one type of board carriers to take boards thru 1) glue curing process for first side and 2)invert carriers with boards, and 3)reflowing second side, and 4) do manual stuffing of th components and 5) take them thru selective wav
Electronics Forum | Sun Jun 07 02:06:26 EDT 1998 | Earl Moon
| Earl, | As always, I am interested in what you have to say, but I am still a little vague on your application of ANSI Y14.5 as it relates to the manufacturability of an assembled printed circuit board. Are you implying that component placement coor
Electronics Forum | Wed Sep 21 12:30:03 EDT 2005 | Rob
Hi Greg, We've used lots of machines over the years & seen lots of different tape related issues - the main one being snap off of the cover tape, usually due to too much glue, over entusiastic heat seal, or a feeder requiring maintainance. Also the
Electronics Forum | Mon Jan 17 14:03:45 EST 2005 | davef
There's a fair amount of information on underfilling CSP and flip chip in the web. Look here to get started: * http://www.asymtek.com/news/articles/2002_globaltronics_csp_and_fcuf.pdf * http://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID
Electronics Forum | Fri Apr 23 14:19:39 EDT 1999 | C.K.
Has anyone had trouble waving and gluing 0603 R's and C's? At my company, our designers have "opened the floodgates" on bottom-side 0603's. We've got an EPK+ with rotary chip and omega wave but can't seem to get skip-free soldering on these guys.
Electronics Forum | Wed Feb 28 11:43:20 EST 2007 | realchunks
Marcin, Think outside the box. If you are glueing the SMT part down, why not have an aperture cut in your stencil (or recut a stencil) between the SMT part and thru-hole. Wave solder hates SMT glue. This will get rid of your solder short problem
Electronics Forum | Fri Apr 23 15:33:50 EDT 1999 | C.K.
| | Has anyone had trouble waving and gluing 0603 R's and C's? At my company, our designers have "opened the floodgates" on bottom-side 0603's. | | | | We've got an EPK+ with rotary chip and omega wave but can't seem to get skip-free soldering on t
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