Electronics Forum: gravity and test (Page 3 of 31)

Dye and Pry

Electronics Forum | Mon Mar 17 03:50:12 EDT 2008 | Sean

Hi All, Besides the above question, I have another one as below: (1) How frequent that we need to perform strain gauge study on ICT, Functional test fixture? Is it a necessary to perform this study each time after ICT, Funtional test fixture preve

Dye and Pry

Electronics Forum | Wed Mar 12 07:33:40 EDT 2008 | callckq

Hi All, One PCBA failed test after went through the Shock Test(Vibration) and suspected to be BGA solder ball crack. We performed dye and pry and found PCB's pad lifted with red mark ink penetrate pad underneath, what does this mean? Can I say the

Die and Ply Procedure

Electronics Forum | Wed Jan 26 01:39:12 EST 2005 | sohct

Is there a procedure for the this test? If yes please forward to me. Thx.

No Clean and Underfill

Electronics Forum | Fri Mar 19 12:17:15 EDT 2010 | stepheniii

Be carefull if you go to no clean. Or be prepared from complaints from the test department regarding their ICT pins getting dirty.

PCBA board and probe

Electronics Forum | Wed Nov 17 20:11:29 EST 2021 | dwl

is there flux on the board? are you probing a test point or a soldered pad? is the probe hitting the right spot?

BGA lands and ICT

Electronics Forum | Tue Mar 19 17:30:46 EST 2002 | rculpepp

Does anyone have or know of any published guidelines for BGA layout on PWB's so that they can be tested. Specifically using micro vias? If anyone has any input regarding other test considerations for BGA devices I'd like to hear from you as well. W

PDBE and PBB replacements???

Electronics Forum | Mon Mar 21 08:46:05 EST 2005 | GS

Hello Gents, Many thanks Davef for your always helpful informations. I have a question, pls, related to : which kind of Test Method are they going to be used to perform analysis (Rohs Compliance verification tests) on EEE in order to find out oncen

Material Ageing and Storage

Electronics Forum | Thu Feb 22 04:00:02 EST 2001 | Scott B

We are increasingly being asked to store components for longer and longer periods which we know through experience leads to reduction or total loss of solderability of the parts. 1) What is the industry accepted shelf life of tin/lead plated compone

Dye and Pry

Electronics Forum | Thu Mar 13 01:42:58 EDT 2008 | Sean

Thanks Real Chunks and Davef...Yours input is valuable to me. My inputs towards your question asked below: Questions are: * Why did you tell us the following? "This BGA is installed with heatsink (with hook at both side of the heat sink) manually b

Thanks chartrain and Doug

Electronics Forum | Thu Nov 04 19:51:28 EST 1999 | John

Thanks folks. The current vendor is doing an alcohol wash, top and bottom, then performing an ionic test on 100 boards. I'm not to confident in the testing because the readings for a "clean" board are 25 ugm/sq in and a "dirty" board are 40 ugm/sq in


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